e-Article
Robust Packaging of Vertically Aligned Graphite Substrate by Copper Micro-Rib Structuring.
Document Type
Article
Source
C; Dec2022, Vol. 8 Issue 4, p70, 13p
Subject
Language
ISSN
23115629
Abstract
Copyright of C is the property of MDPI and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)