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e-Article

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'e-Article' searched 5results | List 1~10
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IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(8):1113-1120 Aug, 2023
Conference
In: THERMINIC 2022 - 28th International Workshop on Thermal Investigations of ICs and Systems, Proceedings, THERMINIC 2022 - 28th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. (THERMINIC 2022 - 28th International Workshop on Thermal Investigations of ICs and Systems, Proceedings, 2022)
Conference
In: Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2021. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, 2021, 2021-September)
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[AR] Portesine, F.
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