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Academic Journal
Chang, Y. H.; Pal, Arkadeb; Yen, P. T. W.; Wang, C. W.; Giri, S.; Blake, G. R.; Gainza, Javier; Hsieh, M. -J; Lin, J. -Y; Huang, C. Y.; Chen, Y. J.; Kuo, T. W.; Tiwari, Ajay; Kakarla, D. Chandrasekhar; Yang, H. D.
Academic Journal
Academic Journal
Metz, A.; Stegmann, D. P.; Panepucci, E. H.; Buehlmann, S.; Huang, C. Y.; McAuley, K. E.; Wang, M.; Wojdyla, J. A.; Sharpe, M. E.; Smith, K. M. L.
Periodical
Liang, Ted; Kim, Seong-Sue; Yang, S. H.; Chen, W. T.; Huang, C. Y.; Lee, Chien-Min; Huang, Joy; Lin, Shy-Jay; Chen, C. L.; Ikuta, Yoshiaki; Satoh, Tomohiko; Nakakita, Yosuke
Proceedings of SPIE; November 2023, Vol. 12751 Issue: 1 p127510G-127510G-9, 1147600p
Conference
2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017 12th International. :306-310 Oct, 2017
Conference
Then, Han Wui; Radosavljevic, M.; Agababov, P.; Ban, I.; Bristol, R.; Chandhok, M.; Chouksey, S.; Holybee, B.; Huang, C. Y.; Krist, B.; Jun, K.; Koirala, P.; Lin, K.; Michaelos, T.; Paul, R.; Peck, J.; Rachmady, W.; Staines, D.; Talukdar, T.; Thomas, N.; Tronic, T.; Fischer, P.; Hafez, W.
2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020
Academic Journal
Determination of strength of Si interposers using PoEF test associated with acoustic emission method
Conference
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016 11th International. :277-280 Oct, 2016
Conference
Then, Han Wui; Dasgupta, S.; Radosavljevic, M.; Agababov, P.; Ban, I.; Bristol, R.; Chandhok, M.; Chouksey, S.; Holybee, B.; Huang, C. Y.; Krist, B.; Jun, K.; Lin, K.; Nidhi, N.; Michaelos, T.; Mueller, B.; Paul, R.; Peck, J.; Rachmady, W.; Staines, D.; Talukdar, T.; Thomas, N.; Tronic, T.; Fischer, P.; Hafez, Walid
2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :17.3.1-17.3.4 Dec, 2019
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[AR] Huang, C. Y.
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