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In Microelectronics Reliability November 2024 162
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In Journal of Manufacturing Processes 28 July 2023 98:19-28
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2002-2007 May, 2022
Conference
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2230-2235 May, 2022
Conference
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2206-2210 May, 2022
Conference
2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :39-40 May, 2022
Academic Journal
Advanced Engineering Materials; May2023, Vol. 25 Issue 10, p1-9, 9p
Academic Journal
Academic Journal
Ahn, Jung; Bak, Sang; Blumenfeld, Yorick; Chai, Jong-Seo; Cheon, Byung-Gu; Cheoun, Myung-Ki; Cho, Donghyun; Cho, Yong; Choi, Bong; Choi, Chang; Choi, Eun; Choi, Hyo; Choi, Min; Choi, Seonho; Choi, Tae; Choi, Yeon; Chung, Kie; Ha, Eun; Ha, Jang; Hahn, In
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[AR] Ha, Eun
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