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e-Article

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'e-Article' searched 131results | List 1~10
Academic Journal
In: Journal of Electronic Packaging. (Journal of Electronic Packaging, 1 December 2024, 146(4))
Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(10):1546-1564 Oct, 2021
Academic Journal
In: International Journal of Heat and Mass Transfer. (International Journal of Heat and Mass Transfer, 15 November 2022, 197)
Conference
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :106-113 2006
Conference
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :79-86 2006
Conference
ICCAD-2005. IEEE/ACM International Conference on Computer-Aided Design, 2005. Computer Aided Design Computer-Aided Design, 2005. ICCAD-2005. IEEE/ACM International Conference on. :225-228 2005
Conference
IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. International Electron Devices Meeting 2005 Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International. :984-987 2005
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[AR] Goodson, K.
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