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'e-Article' searched 410results | List 1~10
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IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(1):168-173 Jan, 2022
Academic Journal
In: Children and Youth Services Review. (Children and Youth Services Review, December 2023, 155)
Academic Journal
Kim, E.S.Govindarajan, S.Gulick, C.English, E.Bloomfield, O.Abukhadra, Y.Bacon, I.Beckerle, J.Cho, S.Donkor, N.E.Garberg, L.Harrington, A.Hoang, M.Lawani, N.Noori, A.Park, E.Parsons, E.Oravitan, P.Chen, M.Molina, C.Richmond, C.Reddi, A.Huang, J.Shugrue, C.Coviello, R.Unver, S.Indelicarto, M.Islamovic, E.McIlroy, R.Yang, A.Hamad, M.Griffin, E.Ahmed, Z.Alla, A.Fitzgerald, P.Choi, A.Das, T.Cheng, Y.Yu, J.Roderiques, T.Lee, E.Liu, L.Harper, J.Wang, J.Suhr, C.Tan, M.Luque, J.Russell Tam, A.Chen, E.Triff, M.Zimmermann, L.Zhang, E.Wood, J.Clark, K.Kpodonu, N.Dey, A.Ecker, A.Chuang, M.Suzuki López, R.K.Sun, H.Wei, Z.Stone, H.Joy Chi, C.Y.Silvestri, A.Orloff, P.Nedumaran, N.Zou, A.Ünver, L.Page, O.Kim, M.Yan Tao Chan, T.Tulloch, A.Hernandez, A.Pillai, A.Chen, C.Chowdhury, N.Huang, L.Mudide, A.Paik, G.Wingate, A.Chisholm, T.Rotondo, C.Rankin, A.E.Rajan, A.Chang, K.Park, S.Kim, S.K.Kockel, L.Rodriguez, B.Garcia, D.Arroyo, F.Morales, E.Camey, S.Cano, G.Bernabe, A.Arroyo, J.Lopez, Y.Gonzalez, E.Zumba, B.Garcia, J.Vargas, E.Trinidad, A.Candelaria, N.Valdez, V.Campuzano, F.Pereznegron, E.Medrano, J.Gutierrez, J.Gutierrez, E.Abrego, E.T.Gutierrez, D.Ortiz, C.Gannett, A.Cain, C.Nakada, S.Mitchell, L.Balanzá, C.Joiner, J.Beard, C.Quinn, L.Conybere, C.Baumgardt, L.L.Buckley, R.Kolberg, Z.Pattison, R.Shazli, A.A.Ganske, P.Sfragara, L.Strub, A.Collier, B.Tamana, H.Ravindran, D.Howden, J.Stewart, M.Shimizu, S.Lewis, G.Turner, V.Stark, L.O’Connor, S.Mastroianni, S.Downey, E.Feigenbaum, M.Tolentino, C.Pace, A.Khan, M.Moon, S.DiPrima, J.Syed, A.Lin, F.Beatty, A.Collette, J.Smullen, R.Suttie, J.Braniff, J.Fong, M.Gutman, L.Irvine, D.Malholtra, S.Medina, J.Park, J.Yin, A.Abromavage, H.Barrett, B.Chen, J.Cho, R.Dilatush, M.Gaw, G.Gu, C.Huang, J.Kilby, H.Markel, E.McClure, K.Phillips, W.Polaski, B.Roselli, A.Saint-Cyr, S.Shin, E.Tatum, K.Tumpunyawat, T.Wetherill, L.Ptaszynska, S.Zeleznik, M.Pesendorfer, A.Nolan, A.Tao, J.Sammeta, D.Nicholson, L.Dinh, G.V.Foltz, M.Vo, A.Ross, M.Tokarski, A.Hariharan, S.Wang, E.Baziuk, M.Tay, A.Maximus Wong, Y.H.Floyd, J.Cui, A.Pierre, K.Coppisetti, N.Kutam, M.Khurjekar, D.Gadzi, A.Gubbay, B.Pedretti, S.Belovich, S.Yeung, T.Fey, M.Shaffer, L.Li, A.Beritela, G.Huyghue, K.Foster, G.Durso-Finley, G.Thierfelder, Q.Kiernan, H.Lenkowsky, A.Thomas, T.Cheng, N.Fox, E.Lantz, N.Chao, O.L’Etoile-Goga, P.King, A.McKinley, P.Read, N.Milberg, D.Lin, L.Wong, M.Gilman, I.Brown, S.Chen, L.Kosai, J.Verbinsky, M.Belshaw-Hood, A.Lee, H.Zhou, C.Lobo, M.Tse, A.Tran, K.Lewis, K.Sonawane, P.Ngo, J.Zuzga, S.Chow, L.Huynh, V.Yang, W.Lim, S.Stites, B.Chang, S.Cruz-Balleza, R.Pelta, M.Kujawski, S.Yuan, C.Standen-Bloom, E.Witt, O.Anders, K.Duane, A.Huynh, N.Lester, B.Fung-Lee, S.Fung, M.Situ, M.Canigiula, P.Dijkgraaf, M.Romero, W.Baula, S.K.Wong, K.Xu, I.Amirapu, A.Martinez, B.Nuygen, R.Norris, L.Nijensohn, N.Altman, N.Maajid, E.Dowling, M.Schmadeke, G.Burkhardt, O.Chanda, J.Doscher, C.Gopal, A.Good, A.Good, J.Herrera, N.Lanting, L.Liem, S.Marks, A.McLaughlin, E.Lee, A.Mohr, C.Patton, E.Pyarali, N.Oczon, C.Richards, D.Good, N.Goss, S.Khan, A.Madonia, R.Mitchell, V.Sun, N.Vranka, T.Cafferky, S.Good, S.Reese, M.Fleig, M.Barnes, A.Arms, E.Pan, E.Mathis, S.A.Bradford, J.Detroy, H.Ferguson, D.Guillermo, E.Manapragada, A.Nanula, D.Serna, B.Singh, K.Sramaty, E.Wells, B.Wiggins, M.Evans, C.J.Lee, M.Oberto, P.Rinehart, J.Barr, L.Baena-Lopez, A.
In: G3: Genes, Genomes, Genetics. (G3: Genes, Genomes, Genetics, September 2023, 13(9))
Academic Journal
IEEE Aerospace and Electronic Systems Magazine IEEE Aerosp. Electron. Syst. Mag. Aerospace and Electronic Systems Magazine, IEEE. 34(11):20-24 Nov, 2019
Academic Journal
In: SKIN: Journal of Cutaneous Medicine. (SKIN: Journal of Cutaneous Medicine, 20 May 2023, 7(3):834-836)
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