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Ayoub, B.; Lhostis, S.; Moreau, S.; Perez, E. Leon; Jourdon, J.; Lamontagne, P.; Deloffre, E.; Mermoz, S.; de Buttet, C.; Balan, V.; Euvard, C.; Exbrayat, Y.; Fremont, H.
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :453-458 Dec, 2020
Conference
Coudrain, Perceval; Charbonnier, J.; Garnier, A.; Vivet, P.; Velard, R.; Vinci, A.; Ponthenier, F.; Farcy, A.; Segaud, R.; Chausse, P.; Arnaud, L.; Lattard, D.; Guthmuller, E.; Romano, G.; Gueugnot, A.; Berger, F.; Beltritti, J.; Mourier, T.; Gottardi, M.; Minoret, S.; Ribiere, C.; Romero, G.; Philip, P.-E.; Exbrayat, Y.; Scevola, D.; Campos, D.; Argoud, M.; Allouti, N.; Eleouet, R.; Fuguet Tortolero, C.; Aumont, C.; Dutoit, D.; Legalland, C.; Michailos, J.; Cheramy, S.; Simon, G.
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :569-578 May, 2019
Conference
Gaben, L.; Balan, V.; Euvrard, C.; Pauliac, S.; Dallery, J.-A.; Bustos, J.; Dechanoz, R.; Hemard, B.; Koscianski, L.; Bossy, X.; Arvet, C.; Vizioz, C.; Barnola, S.; Perrot, C.; Sturm, J.; Exbrayat, Y.; Loup, V.; Besson, P.; Perrin, B.; Previtali, B.; Samson, M.-P.; Barraud, S.; Monfray, S.; Boeuf, F.; Skotnicki, T.; Balestra, F.; Vinet, M.
2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) Ultimate Integration on Silicon (EUROSOI-ULIS), 2017 Joint International EUROSOI Workshop and International Conference on. :120-123 Apr, 2017
Conference
Jourdon, J.; Lhostis, S.; Moreau, S.; Chossat, J.; Arnoux, M.; Sart, C.; Henrion, Y.; Lamontagne, P.; Arnaud, L.; Bresson, N.; Balan, V.; Euvrard, C.; Exbrayat, Y.; Scevola, D.; Deloffre, E.; Mermoz, S.; Martin, A.; Bilgen, H.; Andre, F.; Charles, C.; Bouchu, D.; Farcy, A.; Guillaumet, S.; Jouve, A.; Fremont, H.; Cheramy, S.
2018 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2018 IEEE International. :7.3.1-7.3.4 Dec, 2018
Conference
Jouve, A.; Balan, V.; Bresson, N.; Euvrard-Colnat, C.; Fournel, F.; Exbrayat, Y.; Mauguen, G.; Sater, M. Abdel; Beitia, C.; Arnaud, L.; Cheramy, S.; Lhostis, S.; Farcy, A.; Guillaumet, S.; Mermoz, S.
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2017 IEEE. :1-2 Oct, 2017
Conference
Arnaud, L.; Moreau, S.; Jouve, A.; Jani, I.; Lattard, D.; Fournel, F.; Euvrard, C.; Exbrayat, Y.; Balan, V.; Bresson, N.; Lhostis, S.; Jourdon, J.; Deloffre, E.; Guillaumet, S.; Farcy, A.; Gousseau, S.; Arnoux, M.
2018 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2018 IEEE International. :4D.4-1-4D.4-7 Mar, 2018
Conference
In: ICPT 2017 - International Conference on Planarization/CMP Technology , ICPT 2017 - International Conference on Planarization/CMP Technology. (ICPT 2017 - International Conference on Planarization/CMP Technology, 2017, :133-134)
Academic Journal
In: ANN.ODONTO-STOMAT. . (ANN.ODONTO-STOMAT., 1973, 30(6):241-255)
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[AR] Exbrayat, Y.
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