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Academic Journal
In Journal of Alloys and Compounds 2012 511(1):176-188
Academic Journal
In Acta Materialia 2007 55(15):5057-5071
Academic Journal
In Acta Materialia 2007 55(2):737-752
Academic Journal
In Acta Materialia 2006 54(11):2907-2922
Conference
IEEE International Conference on Robotics and Automation, 2004. Proceedings. ICRA '04. 2004 Robotics and automation Robotics and Automation, 2004. Proceedings. ICRA '04. 2004 IEEE International Conference on. 1:529-534 Vol.1 2004
Academic Journal
IEEE/ASME Transactions on Mechatronics IEEE/ASME Trans. Mechatron. Mechatronics, IEEE/ASME Transactions on. 10(4):428-436 Aug, 2005
Academic Journal
IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 27(3):508-514 Aug, 2004
Interactions between liquid Sn-Bi based solders and contact metals for high temperature applications
Conference
Li, J.F.; Mannan, S.H.; Clode, M.P.; Lobato, H.M.; Liu, C.; Whalley, D.C.; Lawrence, F.T.; Jackson, G.; Steen, H.
Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :441-448 Vol. 1 2005
Academic Journal
Mokhtari, O.; Ashayer, R.; Clode, M.P.; Roshanghias, A.; Khomamizadeh, F.; Kokabi, A.H.; Kotadia, H.R.; Miodownik, M.; Mannan, S.H.
In: Journal of Electronic Materials . (Journal of Electronic Materials, July 2012, 41(7):1907-1914)
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[AR] Clode, M.P.
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