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2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2023 IEEE 29th International Symposium for. :237-240 Oct, 2023
Report
Monthly Notices of the Royal Astronomical Society, 2022, stac1482
Academic Journal
In: Italian Journal of Food Science . (Italian Journal of Food Science, 2024, 36(1):165-174)
Academic Journal
Chawla, T.; Reddy, N.; Jankar, R.; Vengalil, S.; Polavarapu, K.; Preethish-Kumar, V.; Nashi, S.; Bardhan, M.; Nalini, A.; Arunachal, G.; Rajeshwaran, J.; Afsar, M.; Warrier, M.; Thomas, P.T.; Thennarasu, K.
In: Neurology India . (Neurology India, January 2024, 72(1):83-89)
Academic Journal
In: Applied Physics A: Materials Science and Processing . (Applied Physics A: Materials Science and Processing, January 2024, 130(1))
Academic Journal
In: Numerical Heat Transfer; Part A: Applications . (Numerical Heat Transfer; Part A: Applications, 2024, 85(17):2819-2835)
Academic Journal
Afsar, M.; Jia, L.; Ruben, E.A.; Nayak, D.; Bury, P.S.; Cano, K.E.; Nayak, A.; Zhao, X.R.; Shukla, A.; Sung, P.; Wasmuth, E.V.; Olsen, S.K.; Liu, G.Q.; Sayyad, Z.; Gack, M.U.
In: Nature Communications . (Nature Communications, December 2023, 14(1))
Academic Journal
Brady, K.E.; Pilachowski, C.A.; Sneden, C.; Afşar, M.; Mace, G.N.; Jaffe, D.T.; Seifert, R.; Gosnell, N.M.
In: Astronomical Journal . (Astronomical Journal, 1 October 2023, 166(4))
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[AR] Afşar, M.
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