부산대학교 도서관

Recently, the coming fast and large growing opportunity market will be the Internet of Things (IoT) and fifth generation (5G) connectivity application. Particularly for 5G, need to design by beamforming antennas to send Radio Frequency (RF) signals to different network & client devices. By using MIMO (Multi-Input Multi-Out) technology which uses more transmitters and receivers to ensure each antenna of data transmission performance. To meet those new application requirements & challenges, high-gain antennas have been proposedfor wireless connectivity products such as high data transmission, very low latency and low power consumption requirements. A 3D System in Package (3DSiP) including different approach, such as the double side assembly technology and antenna in package (AiP) which is a combination solutions for these requirements. In this paper, SPIL provided an alternative 3D antenna SiP technologu which used surface mount technology (SMT) and 3D antenna integration were designed to shrink the package size, the calculation of package size can be shrunk around 55% area andpackage size reducedfrom 10 x8mm to 6x6mm. This new solution could be integrated an antenna inside SiP module as AiP technology to get smallform factor and additional major benefites to address cost, performance, and time-to-market. The characterization analysis will utilize typical reliability testing (Temperature Cycle Test, High Temperature Storage Test, unbias HAST) results and verify the package structure. Finally, this paper will find out the suitable 3DSiP with advanced antenna integration solution forfuture IoT and 5G Connectivity devices application.