e-Article
Copper Interconnection with Tungsten Cladding for UlSI
Document Type
Conference
Author
Source
1991 Symposium on VLSI Technology VLSI Technology, 1991. Digest of Technical Papers., 1991 Symposium on. :39-40 1991
Subject
Language
Abstract
Increases in cross-talk disturbance, signal delay and current density have a significant impact on the performance of integrated circuits as the metal pitch continues to be scaled down. Using Cu as the interconnection metal offers advantages over the conventional Al alloy. As metal width shrink, the resistance of the interconnection becomes a critical factor in performance [1].