e-Article
Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB
Document Type
Periodical
Source
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(8):1104-1112 Aug, 2023
Subject
Language
ISSN
2156-3950
2156-3985
2156-3985
Abstract
In this work, a concept for the detection of defects in the solder layer between a power semiconductor and the printed circuit board (PCB) is proposed. Four temperature sensors in the form of discrete diodes are placed adjacent to the semiconductor. Multiple test devices with varying fault patterns in the solder layer are subjected to a power pulse, and the temperature response at the sensors is recorded and evaluated with two different methods. Conclusions about the existence, growth, and position of solder defects are drawn from the measured data. The sensitivity and usability of the concept are discussed.