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e-Article

An Aging Monitoring Method of Bond Wires Based on Voltage Ringing Frequency Characteristics in IGBT Modules
Document Type
Periodical
Source
IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 24(2):344-353 Jun, 2024
Subject
Engineered Materials, Dielectrics and Plasmas
Components, Circuits, Devices and Systems
Power, Energy and Industry Applications
Wires
Insulated gate bipolar transistors
Aging
Inductance
Monitoring
Junctions
Voltage measurement
Bond wire aging
frequency characteristics
IGBT module
online monitoring
ringing
Language
ISSN
1530-4388
1558-2574
Abstract
This paper introduces a novel online aging monitoring method for bond wires in IGBT modules based on voltage ringing frequency characteristics. The synchronous Buck converter was selected as the IGBT module test system. The influence of the aging degree of upper bridge arm IGBT module on the voltage ringing peak frequency characteristics of the lower bridge arm IGBT module is studied during the switching transient. Considering the influence of junction temperature, power loop wires inductance and driving resistance on the ringing frequency characteristics, this paper measured the standard ringing frequency under the coupling conditions of each factor. Then a standard database under different working conditions is constructed, and the database is used as a criterion to complete the monitoring task. Finally, the converter-level aging monitoring method of bond wires is realized which is non-invasive and real-time. The experimental results show that the proposed method does not need additional equipment, which reduces the complexity of monitoring circuit and has universal applicability.