학술논문
'학술논문'
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Academic Journal
Augur, R.; Child, C.; Ahn, J.H.; Tang, T.J.; Clevenger, L.; Kioussis, D.; Masuda, H.; Srivastava, R.; Oda, Y.; Oguma, H.; Quon, R.; Kim, B.; Sheng, H.; Hirooka, S.; Gupta, R.; Thomas, A.; Singh, S.M.; Fang, Q.; Schiwon, R.; Hamieh, B.; Wornyo, E.; Allen, S.; Kaltalioglu, E.; Ribes, G.; Zhang, G.; Fryxell, T.; Ogino, A.; Shimada, E.; Aizawa, H.; Minda, H.; Kim, S.O.; Oki, T.; Fujii, K.; Pallachalil, M.; Takewaki, T.; Hu, C.K.; Sundlof, B.; Permana, D.; Bolom, T.; Engel, B.; Labelle, C.; Sapp, B.; Nogami, T.; Simon, A.; Shobha, H.; Gates, S.; Ryan, E.T.; Bonilla, G.; Daubenspeck, T.; Shaw, T.; Osborne, G.; Grill, A.; Edelstein, D.; Restaino, D.; Molis, S.; Spooner, T.; Ferreira, P.; Biery, G.; Sampson, R.
In Microelectronic Engineering April 2012 92:42-44
Conference
Shaw, T.M.; Liu, X-H; Misra, E.; Questad, D.; Bonilla, G.; Wassick, T.; Lamorey, M.; Shobha, H.; Osborne, G.; Kioussis, D.; Wright, J.; Bisson, R.; Paquin, I.; Bouchard, S.S.; Tetreault, S.; Stone, D.; Muzzy, C.; Sundlof, B.; Daubenspeck, T.
2015 IEEE International Integrated Reliability Workshop (IIRW) Integrated Reliability Workshop (IIRW), 2015 IEEE International. :115-118 Oct, 2015
Academic Journal
In: Genetics in Medicine . (Genetics in Medicine, July 2021, 23(7):1255-1262)
Conference
Casey, J.A.; Sundlof, B.; Wassick, T.; Surprenant, R.; Hamel, H.; Stoller, H.; Wiley, K.; Cohen, J.; Berger, M.; Scheider, D.; Laplante, M.; Infantolino, W.
53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :11-17 2003
Conference
Kioussis, D.; Ryan, E.T.; Madan, A.; Klymko, N.; Molis, S.; Sun, Z.; Masuda, H.; Liang, S.; Lee, T.; Restaino, D.; Clevenger, L.; Quon, R.; Augur, R.; Child, C.; Gates, S.M.; Grill, A.; Shobha, H.; Sundlof, B.; Shaw, T.; Bonilla, G.; Daubenspeck, T.; Osborne, G.; Cohen, S.; Virwani, K.
2011 IEEE International Interconnect Technology Conference Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International. :1-3 May, 2011
Conference
Shaw, T. M.; Liu, X-H; Misra, E.; Questad, D.; Bonilla, G.; Wassick, T.; Shobha, H.; Smith, K.; Osborne, G.; Kioussis, D.; Wright, J.; Bisson, R.; Paquin, I.; Lamorey, M.; Bouchard, S. S.; Tetreault, S.; Stone, D.; Muzzy, C.; Sundlof, B.; Daubenspeck, T.
2016 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2016 IEEE International. :6B-4-1-6B-4-6 Apr, 2016
Conference
Shih, D.-Y.; Dang, B.; Gruber, P.; Lu, M.; Kang, S.; Buchwalter, S.; Knickerbocker, J.; Perfecto, E.; Garant, J.; Knickerbocker, S.; Semkow, K.; Sundlof, B.; Busby, J.; Weisman, R.; Ruhmer, K.; Hughlett, E.
2008 International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on. :1-7 Jul, 2008
Conference
2008 IEEE Custom Integrated Circuits Conference; 2008, p81-84, 4p
Academic Journal
In: Environmental Technology (United Kingdom) . (Environmental Technology (United Kingdom), 1 April 2000, 21(4):363-373)
Academic Journal
In: Water, Air, & Soil Pollution . (Water, Air, & Soil Pollution, December 1995, 85(3):1849-1854)
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제한된 항목
[AR] Sundlof, B.
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