학술논문
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Academic Journal
Augur, R.; Child, C.; Ahn, J.H.; Tang, T.J.; Clevenger, L.; Kioussis, D.; Masuda, H.; Srivastava, R.; Oda, Y.; Oguma, H.; Quon, R.; Kim, B.; Sheng, H.; Hirooka, S.; Gupta, R.; Thomas, A.; Singh, S.M.; Fang, Q.; Schiwon, R.; Hamieh, B.; Wornyo, E.; Allen, S.; Kaltalioglu, E.; Ribes, G.; Zhang, G.; Fryxell, T.; Ogino, A.; Shimada, E.; Aizawa, H.; Minda, H.; Kim, S.O.; Oki, T.; Fujii, K.; Pallachalil, M.; Takewaki, T.; Hu, C.K.; Sundlof, B.; Permana, D.; Bolom, T.; Engel, B.; Labelle, C.; Sapp, B.; Nogami, T.; Simon, A.; Shobha, H.; Gates, S.; Ryan, E.T.; Bonilla, G.; Daubenspeck, T.; Shaw, T.; Osborne, G.; Grill, A.; Edelstein, D.; Restaino, D.; Molis, S.; Spooner, T.; Ferreira, P.; Biery, G.; Sampson, R.
In Microelectronic Engineering April 2012 92:42-44
Conference
Shaw, T.M.; Liu, X-H; Misra, E.; Questad, D.; Bonilla, G.; Wassick, T.; Lamorey, M.; Shobha, H.; Osborne, G.; Kioussis, D.; Wright, J.; Bisson, R.; Paquin, I.; Bouchard, S.S.; Tetreault, S.; Stone, D.; Muzzy, C.; Sundlof, B.; Daubenspeck, T.
2015 IEEE International Integrated Reliability Workshop (IIRW) Integrated Reliability Workshop (IIRW), 2015 IEEE International. :115-118 Oct, 2015
Conference
Mertens, H.; Ritzenthaler, R.; Pena, V.; Santoro, G.; Kenis, K.; Schulze, A.; Litta, E. D.; Chew, S. A.; Devriendt, K.; Chiarella, r.; Demuynck, S.; Yakimets, D.; Jang, D.; Spessot, A.; Eneman, G.; Dangol, A.; Lagrain, P.; Bender, H.; Sun, S.; Korolik, M.; Kioussis, D.; Kim, M.; Bu, K-.H.; Chen, S. C.; Cogorno, M.; Devrajan, J.; Machillot, J.; Yoshida, N.; Kim, N.; Barla, K.; Mocuta, D.; Horiguchi, N.
2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :37.4.1-37.4.4 Dec, 2017
Academic Journal
In Solid State Electronics 2001 45(6):1049-1054
Conference
Kioussis, D.; Ryan, E.T.; Madan, A.; Klymko, N.; Molis, S.; Sun, Z.; Masuda, H.; Liang, S.; Lee, T.; Restaino, D.; Clevenger, L.; Quon, R.; Augur, R.; Child, C.; Gates, S.M.; Grill, A.; Shobha, H.; Sundlof, B.; Shaw, T.; Bonilla, G.; Daubenspeck, T.; Osborne, G.; Cohen, S.; Virwani, K.
2011 IEEE International Interconnect Technology Conference Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International. :1-3 May, 2011
Conference
Bao, J.; Lustig, N.; Engbrecht, E.; Gill, J.; Filippi, R.; Lee, T. C.; Chanda, K.; Kioussis, D.; Lisi, A.; Cheng, T.; Law, S. B.; Simon, A.; Flaitz, P.; Choi, J.; Tseng, W.; Zielinski, E.; Gates, S. M.; Grill, A.; Nguyen, S.; Shobha, H.
2010 IEEE International Interconnect Technology Conference Interconnect Technology Conference (IITC), 2010 International. :1-3 Jun, 2010
Conference
Shaw, T. M.; Liu, X-H; Misra, E.; Questad, D.; Bonilla, G.; Wassick, T.; Shobha, H.; Smith, K.; Osborne, G.; Kioussis, D.; Wright, J.; Bisson, R.; Paquin, I.; Lamorey, M.; Bouchard, S. S.; Tetreault, S.; Stone, D.; Muzzy, C.; Sundlof, B.; Daubenspeck, T.
2016 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2016 IEEE International. :6B-4-1-6B-4-6 Apr, 2016
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[AR] Kioussis, D.
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