학술논문
Competitive and cost effective copper/low-k interconnect (BEOL) for 28nm CMOS technologies
Document Type
Conference Paper
Author
Augur, R.; Child, C.; Ahn, J.H.; Tang, T.J.; Clevenger, L.; Kioussis, D.; Masuda, H.; Srivastava, R.; Oda, Y.; Oguma, H.; Quon, R.; Kim, B.; Sheng, H.; Hirooka, S.; Gupta, R.; Thomas, A.; Singh, S.M.; Fang, Q.; Schiwon, R.; Hamieh, B.; Wornyo, E.; Allen, S.; Kaltalioglu, E.; Fryxell, T.; Ogino, A.; Shimada, E.; Aizawa, H.; Minda, H.; Kim, S.O.; Oki, T.; Fujii, K.; Pallachalil, M.; Takewaki, T.; Hu, C.K.; Sundloff, B.; Permana, D.; Bolom, T.; Engel, B.; Labelle, C.; Sapp, B.; Shobha, H.; Gates, S.; Ryan, E.T.; Bonilla, G.; Daubenspeck, T.; Shaw, T.; Osborne, G.; Grill, A.; Edelstein, D.; Restaino, D.; Molis, S.; Spooner, T.; Ferreira, P.; Biery, G.; Sampson, R.
Source
In: Advanced Metallization Conference (AMC) , Advanced Metallization Conference 2010. (Advanced Metallization Conference (AMC), 2010, :41-42)
Subject
Language
English
ISSN
15401766