학술논문
'학술논문'
에서 검색결과 46건 | 목록
1~10
Conference
Seshadri, I.; Miller, E.; Church, J.; Chu, A.; Zhang, J.; Greene, A.; Frougier, J.; Li, T.; Cabrera, Y.; Kenath, G.; Burkhardt, M.; Skordas, S.; Meli, L.; Felix, N.
2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
Conference
Loubet, N.; Hook, T.; Montanini, P.; Yeung, C.-W.; Kanakasabapathy, S.; Guillom, M.; Yamashita, T.; Zhang, J.; Miao, X.; Wang, J.; Young, A.; Chao, R.; Kang, M.; Liu, Z.; Fan, S.; Hamieh, B.; Sieg, S.; Mignot, Y.; Xu, W.; Seo, S.-C.; Yoo, J.; Mochizuki, S.; Sankarapandian, M.; Kwon, O.; Carr, A.; Greene, A.; Park, Y.; Frougier, J.; Galatage, R.; Bao, R.; Shearer, J.; Conti, R.; Song, H.; Lee, D.; Kong, D.; Xu, Y.; Arceo, A.; Bi, Z.; Xu, P.; Muthinti, R.; Li, J.; Wong, R.; Brown, D.; Oldiges, P.; Robison, R.; Arnold, J.; Felix, N.; Skordas, S.; Gaudiello, J.; Standaert, T.; Jagannathan, H.; Corliss, D.; Na, M.-H.; Knorr, A.; Wu, T.; Gupta, D.; Lian, S.; Divakaruni, R.; Gow, T.; Labelle, C.; Lee, S.; Paruchuri, V.; Bu, H.; Khare, M.
2017 Symposium on VLSI Technology VLSI Technology, 2017 Symposium on. :T230-T231 Jun, 2017
Conference
Skordas, S.; Tulipe, D. C. La; Winstel, K.; Vo, T. A.; Priyadarshini, D.; Upham, A.; Song, D.; Hubbard, A.; Johnson, R.; Cauffman, K.; Kanakasabapathy, S.; Lin, W.; Knupp, S.; Malley, M.; Farooq, M. G.; Hannon, R.; Berger, D.; Iyer, S. S.
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on. :203-208 May, 2012
Conference
Lee, K. L.; Lauer, I.; Ronsheim, P.; Neumayer, D.; McCoy, S.; Kulkarni, P.; Chan, J.; Skordas, S.; Zhu, Y.; Gelpey, J.; Park, Dae-gyu
2010 International Workshop on Junction Technology Extended Abstracts Junction Technology (IWJT), 2010 International Workshop on. :1-5 May, 2010
Conference
Xie, R.; Montanini, P.; Akarvardar, K.; Tripathi, N.; Haran, B.; Johnson, S.; Hook, T.; Hamieh, B.; Corliss, D.; Wang, J.; Miao, X.; Sporre, J.; Fronheiser, J.; Loubet, N.; Sung, M.; Sieg, S.; Mochizuki, S.; Prindle, C.; Seo, S.; Greene, A.; Shearer, J.; Labonte, A.; Fan, S.; Liebmann, L.; Chao, R.; Arceo, A.; Chung, K.; Cheon, K.; Adusumilli, P.; Amanapu, H.P.; Bi, Z.; Cha, J.; Chen, H.-C.; Conti, R.; Galatage, R.; Gluschenkov, O.; Kamineni, V.; Kim, K.; Lee, C.; Lie, F.; Liu, Z.; Mehta, S.; Miller, E.; Niimi, H.; Niu, C.; Park, C.; Park, D.; Raymond, M.; Sahu, B.; Sankarapandian, M.; Siddiqui, S.; Southwick, R.; Sun, L.; Surisetty, C.; Tsai, S.; Whang, S.; Xu, P.; Xu, Y.; Yeh, C.; Zeitzoff, P.; Zhang, J.; Li, J.; Demarest, J.; Arnold, J.; Canaperi, D.; Dunn, D.; Felix, N.; Gupta, D.; Jagannathan, H.; Kanakasabapathy, S.; Kleemeier, W.; Labelle, C.; Mottura, M.; Oldiges, P.; Skordas, S.; Standaert, T.; Yamashita, T.; Colburn, M.; Na, M.; Paruchuri, V.; Lian, S.; Divakaruni, R.; Gow, T.; Lee, S.; Knorr, A.; Bu, H.; Khare, M.
2016 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2016 IEEE International. :2.7.1-2.7.4 Dec, 2016
Academic Journal
In Surface Science 20 January 2000 445(2-3):224-234
Conference
Chen, Q.; Belyansky, M.; Sulehria, Y.; Horibe, A.; Qin, L.; Pujari, R.; Perfecto, E.; Lie, F.L.; Butt, S.; Polomoff, N.; Miyazawa, R.; Kohara, S.; Farooq, M.; Hisada, T.; Oakley, J.; Skordas, S.; Fan, S.; Sakuma, K.; Knickerbocker, J.; McHerron, D.; Tamura, T.; Ishii, T.; Jaipan, P.; Nishimura, S.; Son, I.; Maeda, Y.; Koga, T.; Klein, J.; Tashiro, K.; Arkalgud, S.; Kondo, Y.
In: Proceedings - Electronic Components and Technology Conference , Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. (Proceedings - Electronic Components and Technology Conference, 2023, 2023-May:1175-1180)
Conference
In: Proceedings of SPIE - The International Society for Optical Engineering , Novel Patterning Technologies 2023. (Proceedings of SPIE - The International Society for Optical Engineering, 2023, 12497)
Academic Journal
IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 27(3):426-430 Aug, 2014
Conference
Farooq, M.; Kumar, A.; Lee, S.-K.; Bonam, R.; Gomez, J.-M.; Kelly, J.; Hosokawa, K.; Nomura, A.; Kohda, Y.; Dickson, T.; Sakuma, K.; Mori, H.; Rubin, J.; Saraf, I.; Pai, V.; Nieves, P.; Li, Y.; Delapena, A.; Wassick, T.; Perfecto, E.; Carr, C.; Sardesai, V.; Miller, E.; Oakley, J.; Skordas, S.; Teehan, S.; McHerron, D.; Burns, J.; Divakaruni, R.
In: Proceedings - Electronic Components and Technology Conference , Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022. (Proceedings - Electronic Components and Technology Conference, 2022, 2022-May:977-980)
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[AR] Skordas, S.
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