학술논문
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Academic Journal
Fenouillet-Beranger, C.; Perreau, P.; Denorme, S.; Tosti, L.; Andrieu, F.; Weber, O.; Monfray, S.; Barnola, S.; Arvet, C.; Campidelli, Y.; Haendler, S.; Beneyton, R.; Perrot, C.; de Buttet, C.; Gros, P.; Pham-Nguyen, L.; Leverd, F.; Gouraud, P.; Abbate, F.; Baron, F.; Torres, A.; Laviron, C.; Pinzelli, L.; Vetier, J.; Borowiak, C.; Margain, A.; Delprat, D.; Boedt, F.; Bourdelle, K.; Nguyen, B.-Y.; Faynot, O.; Skotnicki, T.
In Solid State Electronics 2010 54(9):849-854
Academic Journal
Bidal, G.; Loubet, N.; Fenouillet-Beranger, C.; Denorme, S.; Perreau, P.; Fleury, D.; Clement, L.; Laviron, C.; Leverd, F.; Gouraud, P.; Barnola, S.; Beneyton, R.; Torres, A.; Duluard, C.; Chapon, J.D.; Orlando, B.; Salvetat, T.; Grosjean, M.; Deloffre, E.; Pantel, R.; Dutartre, D.; Monfray, S.; Ghibaudo, G.; Boeuf, F.; Skotnicki, T.
In Solid State Electronics 2009 53(7):735-740
Academic Journal
Fenouillet-Beranger, C.; Denorme, S.; Perreau, P.; Buj, C.; Faynot, O.; Andrieu, F.; Tosti, L.; Barnola, S.; Salvetat, T.; Garros, X.; Cassé, M.; Allain, F.; Loubet, N.; Pham-Nguyen, L.; Deloffre, E.; Gros-Jean, M.; Beneyton, R.; Laviron, C.; Marin, M.; Leyris, C.; Haendler, S.; Leverd, F.; Gouraud, P.; Scheiblin, P.; Clement, L.; Pantel, R.; Deleonibus, S.; Skotnicki, T.
In Solid State Electronics 2009 53(7):730-734
Academic Journal
Hernandez, M. ; Venturini, J.; Berard, D.; Kerrien, G.; Sarnet, T.; Débarre, D.; Boulmer, J.; Laviron, C.; Camel, D.; Santailler, J.-L.; Akhouayri, H.
In Materials Science & Engineering B 2004 114:105-108
Conference
2013 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2013 IEEE International. :1-6 Oct, 2013
Conference
Souare, P. M.; de Crecy, F.; Fiori, V.; Ben Jamaa, H.; Farcy, A.; Gallois-Garreignot, S.; Borbely, A.; Colonna, J.-P.; Coudrain, P.; Giraud, B.; Laviron, C.; Cheramy, S.; Tavernier, C.; Michailos, J.
2013 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2013 IEEE International. :1-6 Oct, 2013
Conference
Joblot, S.; Farcy, A.; Hotellier, N.; Jouve, A.; de Crecy, F.; Garnier, A.; Argoud, M.; Ferrandon, C.; Colonna, J. P.; Franiatte, R.; Laviron, C.; Cheramy, S.
2013 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2013 IEEE International. :1-7 Oct, 2013
Conference
Segaud, R.; Aumont, C.; Eleouet, R.; Allouti, N.; Mourier, T.; Gabette, L.; Minoret, S.; Magis, T.; Roman, A.; Hida, R.; Ratin, C.; Lachal, L.; Delachanal, S.; Cordini, M. L.; Nardi, P.; Feldis, H.; Charpentier, A.; Chausse, P.; Laviron, C.; Cheramy, S.
2013 Eurpoean Microelectronics Packaging Conference (EMPC) Microelectronics Packaging Conference (EMPC) , 2013 European. :1-6 Sep, 2013
Conference
Jouve, A.; Vial, K.; Rolland, E.; Coudrain, P.; Aumont, C.; Laviron, C.; Fournel, F.; Pellat, M.; Montmeat, P.; Allouti, N.; Eleouet, R.; Argoud, M.; Dechamp, J.; Bally, L.; Vignoud, L.; Donche, C.; Hida, R.; Ratin, C.; Magis, T.; Loup, V.; Kachtouli, R.; Gabette, L.; Mourier, T.; Cheramy, S.; Sillon, N.
2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :101-106 May, 2013
Academic Journal
Hernandez, M.; Venturini, J.; Zahorski, D.; Boulmer, J.; Débarre, D.; Kerrien, G.; Sarnet, T.; Laviron, C.; Semeria, M.N.; Camel, D.; Santailler, J.L.
In Applied Surface Science 2003 208:345-351
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제한된 항목
[AR] Laviron, C.
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