학술논문
'학술논문'
에서 검색결과 78건 | 목록
1~10
Conference
Ayoub, B.; Lhostis, S.; Moreau, S.; Perez, E. Leon; Jourdon, J.; Lamontagne, P.; Deloffre, E.; Mermoz, S.; de Buttet, C.; Balan, V.; Euvard, C.; Exbrayat, Y.; Fremont, H.
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :453-458 Dec, 2020
Academic Journal
Bidal, G.; Loubet, N.; Fenouillet-Beranger, C.; Denorme, S.; Perreau, P.; Fleury, D.; Clement, L.; Laviron, C.; Leverd, F.; Gouraud, P.; Barnola, S.; Beneyton, R.; Torres, A.; Duluard, C.; Chapon, J.D.; Orlando, B.; Salvetat, T.; Grosjean, M.; Deloffre, E.; Pantel, R.; Dutartre, D.; Monfray, S.; Ghibaudo, G.; Boeuf, F.; Skotnicki, T.
In Solid State Electronics 2009 53(7):735-740
Academic Journal
Fenouillet-Beranger, C.; Denorme, S.; Perreau, P.; Buj, C.; Faynot, O.; Andrieu, F.; Tosti, L.; Barnola, S.; Salvetat, T.; Garros, X.; Cassé, M.; Allain, F.; Loubet, N.; Pham-Nguyen, L.; Deloffre, E.; Gros-Jean, M.; Beneyton, R.; Laviron, C.; Marin, M.; Leyris, C.; Haendler, S.; Leverd, F.; Gouraud, P.; Scheiblin, P.; Clement, L.; Pantel, R.; Deleonibus, S.; Skotnicki, T.
In Solid State Electronics 2009 53(7):730-734
In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration
Academic Journal
Ayoub, B.; Lhostis, S.; Mermoz, S.; Souchier, E.; Deloffre, E.; Moreau, S.; Frémont, H.; Escoubas, S.; Cornelius, T.W.; Thomas, O.
In: Microelectronic Engineering . (Microelectronic Engineering, 15 May 2022, 261)
Conference
2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-7 Sep, 2016
Conference
Lhostis, S.; Farcy, A.; Deloffre, E.; Lorut, F.; Mermoz, S.; Henrion, Y.; Berthier, L.; Bailly, F.; Scevola, D.; Guyader, F.; Gigon, F.; Besset, C.; Pellissier, S.; Gay, L.; Hotellier, N.; Le Berrigo, A. -L.; Moreau, S.; Balan, V.; Fournel, F.; Jouve, A.; Cheramy, S.; Arnoux, M.; Rebhan, B.; Maier, G. A.; Chitu, L.
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :869-876 May, 2016
Academic Journal
Thomas, M.; Farcy, A.; Gaillard, N.; Perrot, C.; Gros-Jean, M.; Matko, I.; Cordeau, M.; Saikaly, W.; Proust, M.; Caubet, P.; Deloffre, E.; Crémer, S.; Bruyère, S.; Chenevier, B.; Torres, J.
In Microelectronic Engineering 2006 83(11):2163-2168
Conference
Rebhan, B.; Bernauer, M.; Wagenleitner, T.; Heilig, M.; Kurz, F.; Lhostis, S.; Deloffre, E.; Jouve, A.; Balan, V.; Chitu, L.
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-4 Dec, 2015
Academic Journal
Deloffre, E.; Montès, L.; Ghibaudo, G.; Bruyère, S.; Blonkowski, S.; Bécu, S.; Gros-Jean, M.; Crémer, S.
In Microelectronics Reliability 2005 45(5):925-928
Conference
Jourdon, J.; Lhostis, S.; Moreau, S.; Chossat, J.; Arnoux, M.; Sart, C.; Henrion, Y.; Lamontagne, P.; Arnaud, L.; Bresson, N.; Balan, V.; Euvrard, C.; Exbrayat, Y.; Scevola, D.; Deloffre, E.; Mermoz, S.; Martin, A.; Bilgen, H.; Andre, F.; Charles, C.; Bouchu, D.; Farcy, A.; Guillaumet, S.; Jouve, A.; Fremont, H.; Cheramy, S.
2018 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2018 IEEE International. :7.3.1-7.3.4 Dec, 2018
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제한된 항목
[AR] Deloffre, E.
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