학술논문
'학술논문'
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Academic Journal
In Solid State Electronics February 2023 200
Academic Journal
Vianne, B.; Escoubas, S.; Krauss, C.; Richard, M.-I.; Labat, S.; Chahine, G.; Micha, J.-S.; Schülli, T.; Fiori, V.; Farcy, A.; Thomas, O.
In Microelectronic Engineering 20 April 2016 156:59-64
Academic Journal
Vianne, B.; Escoubas, S.; Richard, M.-I.; Labat, S.; Chahine, G.; Schülli, T.; Farcy, A.; Bar, P.; Fiori, V.; Thomas, O.
In Microelectronic Engineering 2 April 2015 137:117-123
Conference
Steckel, J. S.; Josse, E.; Pattantyus-Abraham, A. G.; Bidaud, M.; Mortini, B.; Bilgen, H.; Arnaud, O.; Allegret-Maret, S.; Saguin, F.; Mazet, L.; Lhostis, S.; Berger, T.; Haxaire, K.; Chapelon, L. L.; Parmigiani, L.; Gouraud, P.; Brihoum, M.; Bar, P.; Guillermet, M.; Favreau, S.; Duru, R.; Fantuz, J.; Ricq, S.; Ney, D.; Hammad, I.; Roy, D.; Arnaud, A.; Vianne, B.; Nayak, G.; Virollet, N.; Farys, V.; Malinge, P.; Tournier, A.; Lalanne, F.; Crocherie, A.; Galvier, J.; Rabary, S.; Noblanc, O.; Wehbe-Alause, H.; Acharya, S.; Singh, A.; Meitzner, J.; Aher, D.; Yang, H.; Romero, J.; Chen, B.; Hsu, C.; Cheng, K. C.; Chang, Y.; Sarmiento, M.; Grange, C.; Mazaleyrat, E.; Rochereau, K.
2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :23.4.1-23.4.4 Dec, 2021
Conference
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-6 Dec, 2017
Conference
Vianne, B.; Krauss, C.; Escoubas, S.; Richard, M.-I.; Labaf, S.; Chahine, G.; Schullli, T.; Micha, J.-S.; Fiori, V.; Farcy, A.; Thomas, O.
2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International. :59-62 May, 2015
Conference
Vianne, B.; Morin, P.; Beylier, C.; Giraudin, J.-C.; Desmoulins, S.; Gonella, R.; Juncker, A.; Fried, D.
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2017 IEEE. :1-2 Oct, 2017
Academic Journal
IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 18(4):529-533 Dec, 2018
Conference
Michailos, J.; Coudrain, P.; Farcy, A.; Hotellier, N.; Cheramy, S.; Lhostis, S.; Deloffre, E.; Sanchez, Y.; Jouve, A.; Guyader, F.; Saugier, E.; Fiori, V.; Vivet, P.; Vinet, M.; Fenouillet-Beranger, C.; Casset, F.; Batude, P.; Breuf, F.; Henrion, Y.; Vianne, B.; Collin, L.-M.; Colonna, J.-P.; Benaissa, L.; Brunet, L.; Prieto, R.; Velard, R.; Ponthenier, F.
2015 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2015 IEEE International. :8.5.1-8.5.4 Dec, 2015
Conference
Vianne, B.; Farcy, A.; Fiori, V.; Chappaz, C.; Chevrier, N.; Lobascio, G.; Chausse, P.; Ponthenier, F.; Ruckly, A.; Escoubas, S.; Thomas, O.
2015 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2015 International. :TS11.4.1-TS11.4.7 Aug, 2015
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[AR] Vianne, B.
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