학술논문
'학술논문'
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Conference
Rideau, D.; Uhring, W.; Bianchi, R. A.; Helleboid, R.; Mugny, G.; Grebot, J.; Manouvrier, J.R.; Neri, R.; Brun, F.; Lakeh, M. Dolatpoor; Rink, S.; Kammerer, J-B.; Lallement, C.; Lacombe, E.; Golanski, D.; Rae, B.; Bah, T. M.; Twaddle, F.; Quenette, V.; Marchand, G.; Buj, C.; Fillon, R.; Henrion, Y.; Nicholson, I.; Agnew, M.; Basset, M.; Perrier, R.; Al-Rawhani, M.; Mamdy, B.; Pellegrin, S.; Gouget, G.; Maciazek, P.; Juge, A.; Dartigues, A.; Alause, H. Wehbe
ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2023 - IEEE 53rd European. :144-147 Sep, 2023
Conference
Lhostis, S.; Farcy, A.; Deloffre, E.; Lorut, F.; Mermoz, S.; Henrion, Y.; Berthier, L.; Bailly, F.; Scevola, D.; Guyader, F.; Gigon, F.; Besset, C.; Pellissier, S.; Gay, L.; Hotellier, N.; Le Berrigo, A. -L.; Moreau, S.; Balan, V.; Fournel, F.; Jouve, A.; Cheramy, S.; Arnoux, M.; Rebhan, B.; Maier, G. A.; Chitu, L.
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :869-876 May, 2016
Conference
Moreau, S.; Jourdon, J.; Lhostis, S.; Bouchu, D.; Henrion, Y.; Arnaud, L.; Jouve, A.; Balan, V.; Fournel, F.; Lamontagne, P.; Cheramy, S.; Cioccio, L. Di
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :11-11 May, 2019
Conference
Jourdon, J.; Lhostis, S.; Moreau, S.; Chossat, J.; Arnoux, M.; Sart, C.; Henrion, Y.; Lamontagne, P.; Arnaud, L.; Bresson, N.; Balan, V.; Euvrard, C.; Exbrayat, Y.; Scevola, D.; Deloffre, E.; Mermoz, S.; Martin, A.; Bilgen, H.; Andre, F.; Charles, C.; Bouchu, D.; Farcy, A.; Guillaumet, S.; Jouve, A.; Fremont, H.; Cheramy, S.
2018 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2018 IEEE International. :7.3.1-7.3.4 Dec, 2018
Conference
2016 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2016 IEEE International. :8.1.1-8.1.4 Dec, 2016
Academic Journal
IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 38(11):1547-1550 Nov, 2017
Conference
Michailos, J.; Coudrain, P.; Farcy, A.; Hotellier, N.; Cheramy, S.; Lhostis, S.; Deloffre, E.; Sanchez, Y.; Jouve, A.; Guyader, F.; Saugier, E.; Fiori, V.; Vivet, P.; Vinet, M.; Fenouillet-Beranger, C.; Casset, F.; Batude, P.; Breuf, F.; Henrion, Y.; Vianne, B.; Collin, L.-M.; Colonna, J.-P.; Benaissa, L.; Brunet, L.; Prieto, R.; Velard, R.; Ponthenier, F.
2015 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2015 IEEE International. :8.5.1-8.5.4 Dec, 2015
Conference
Jani, I.; Lattard, D.; Vivet, P.; Arnaud, L.; Cheramy, S.; Beigne, E.; Farcy, A.; Jourdon, J.; Henrion, Y.; Deloffre, E.; Bilgen, H.
In: Proceedings - Electronic Components and Technology Conference , Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. (Proceedings - Electronic Components and Technology Conference, May 2019, 2019-May:1926-1932)
Academic Journal
In: Physica C: Superconductivity and its applications . (Physica C: Superconductivity and its applications, December 1994, 235-240(PART 3):1647-1648)
Conference
In: Technical Digest - International Electron Devices Meeting, IEDM , 2016 IEEE International Electron Devices Meeting, IEDM 2016. (Technical Digest - International Electron Devices Meeting, IEDM, 31 January 2017, :8.1.1-8.1.4)
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제한된 항목
[AR] Henrion, Y.
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