학술논문

Fully-depleted SOI technology using high-k and single-metal gate for 32 nm node LSTP applications featuring 0.179 μm2 6T-SRAM bitcell
Document Type
Conference
Source
2007 IEEE International Electron Devices Meeting Electron Devices Meeting, 2007. IEDM 2007. IEEE International. :267-270 Dec, 2007
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
High K dielectric materials
High-K gate dielectrics
Leakage current
MOS devices
Electrodes
Capacitance
Thin films
Threshold voltage
Boats
MOSFETs
Language
ISSN
0163-1918
2156-017X
Abstract
In this paper, we report on FD-SOI with high-k and single metal gate as a possible candidate for the 32 nm LOP and LSTP nodes. Good I on /I off performance for nMOS and pMOS transistors in the ultra-low-leakage regime (I off =6.6 pA/μm) are presented. In addition co-integration of high voltage devices with EOT 29A/V dd 1.8 V are made. For the first time, the functionality of 0.248 μm and 0.179 μm 2 6T-SRAM bit-cells is demonstrated on FDSOI technology with a high-k/metal gate stack.