학술논문
'학술논문'
에서 검색결과 64건 | 목록
1~20
Academic Journal
Electronic Materials Letters. 21(4):520-531
Academic Journal
Electronic Materials Letters. 20(4):393-401
Conference
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :348-353 Jun, 2020
Conference
Son, Kirak; Kim, Gahui; Ryu, Hyodong; Park, Gyu-Tae; Son, Ho-Young; Kim, Nam-Seog; Yang, Cheol-Woong; Kim, Young-Cheon; Han, Jeong Sam; Park, Young-Bae
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :2246-2251 May, 2019
Conference
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :937-941 May, 2019
Academic Journal
Electronic Materials Letters, 18(5), pp.431-439 Sep, 2022
Academic Journal
Electronic Materials Letters, 21(4), pp.520-531 Jul, 2025
Academic Journal
마이크로전자 및 패키징학회지 31. 2 (2024): 9-15.
Academic Journal
마이크로전자 및 패키징학회지 29. 2 (2022): 81-89.
Academic Journal
마이크로전자 및 패키징학회지 29. 2 (2022): 59-64.
Academic Journal
마이크로전자 및 패키징학회지 29. 2 (2022): 43-48.
Electromigration polarity effect of Cu/Ni/Sn-Ag microbumps for three-dimensional integrated circuits
Conference
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-3 Dec, 2017
Academic Journal
Academic Journal
Electronic Materials Letters, 17(2), pp.157-163 Mar, 2021
Academic Journal
Electronic Materials Letters, 16(4), pp.311-320 Jul, 2020
Academic Journal
Journal of Materials Science: Materials in Electronics. 33(22):17493-17501
Academic Journal
대한금속재료학회지 / Korean journal of metals and materials. Apr 05, 2018 56(4):280
Academic Journal
대한금속재료학회지 / Korean journal of metals and materials. Nov 05, 2017 55(11):798
검색 결과 제한하기
제한된 항목
[검색어] Son, Kirak
발행연도 제한
-
학술DB(Database Provider)
저널명(출판물, Title)
출판사(Publisher)
자료유형(Source Type)
주제어
언어