학술논문
'학술논문'
에서 검색결과 46건 | 목록
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A study on the interfacial adhesion energy between capping layer and dielectric for cu interconnects
Academic Journal
Kim, Cheol; Son, Kirak; Kim, Gahui; Kim, Sungtae; Lee, Sol-Kyu; Lee, So-Yeon; Park, Young-Bae; Joo, Young-Chang
In Microelectronics Reliability January 2021 116
Academic Journal
Electronic Materials Letters; Jul2025, Vol. 21 Issue 4, p520-531, 12p
Academic Journal
Electronic Materials Letters; May2025, Vol. 21 Issue 3, p429-442, 14p
Conference
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :348-353 Jun, 2020
Conference
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1677-1683 Jun, 2020
Conference
Son, Kirak; Kim, Gahui; Ryu, Hyodong; Park, Gyu-Tae; Son, Ho-Young; Kim, Nam-Seog; Yang, Cheol-Woong; Kim, Young-Cheon; Han, Jeong Sam; Park, Young-Bae
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :2246-2251 May, 2019
Conference
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :937-941 May, 2019
Academic Journal
Academic Journal
Electronic Materials Letters; Jul2024, Vol. 20 Issue 4, p402-413, 12p
Academic Journal
Electronic Materials Letters; Jul2024, Vol. 20 Issue 4, p393-401, 9p
Electromigration polarity effect of Cu/Ni/Sn-Ag microbumps for three-dimensional integrated circuits
Conference
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-3 Dec, 2017
Academic Journal
Mori, Yuki; Cheon, Taehoon; Kotsugi, Yohei; Kim, Youn‐Hye; Park, Yejin; Ansari, Mohd Zahid; Mohapatra, Debananda; Jang, Yujin; Bae, Jong‐Seong; Kwon, Woobin; Kim, Gahui; Park, Young‐Bae; Lee, Han‐Bo‐Ram; Song, Wooseok; Kim, Soo‐Hyun
Small; 8/23/2023, Vol. 19 Issue 34, p1-11, 11p
Academic Journal
Interfacial Adhesion Energies of Uniformly Self-Formed Cr2O3 Barriers for Advanced Co Interconnects.
Academic Journal
Lee, Seongi; Hwang, Soon-Gyu; Kim, Gahui; Kim, Cheol; Kwon, Woobin; Park, Young-Bae; Joo, Young-Chang
Electronic Materials Letters; Sep2022, Vol. 18 Issue 5, p447-455, 9p
Academic Journal
Electronic Materials Letters; Sep2022, Vol. 18 Issue 5, p431-439, 9p
Academic Journal
Academic Journal
Electronic Materials Letters; Mar2021, Vol. 17 Issue 2, p157-163, 7p
Academic Journal
Journal of Materials Chemistry C; 11/7/2020, Vol. 8 Issue 41, p14531-14539, 9p
Academic Journal
Electronic Materials Letters; Jul2020, Vol. 16 Issue 4, p311-320, 10p
Academic Journal
Journal of Materials Science: Materials in Electronics; Feb2019, Vol. 30 Issue 3, p2334-2341, 8p
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[AR] Kim, Gahui
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