학술논문
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A study on the interfacial adhesion energy between capping layer and dielectric for cu interconnects
Academic Journal
Kim, Cheol; Son, Kirak; Kim, Gahui; Kim, Sungtae; Lee, Sol-Kyu; Lee, So-Yeon; Park, Young-Bae; Joo, Young-Chang
In Microelectronics Reliability January 2021 116
Academic Journal
Electronic Materials Letters; Jul2024, Vol. 20 Issue 4, p393-401, 9p
Conference
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :348-353 Jun, 2020
Conference
Son, Kirak; Kim, Gahui; Ryu, Hyodong; Park, Gyu-Tae; Son, Ho-Young; Kim, Nam-Seog; Yang, Cheol-Woong; Kim, Young-Cheon; Han, Jeong Sam; Park, Young-Bae
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :2246-2251 May, 2019
Conference
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :937-941 May, 2019
Electromigration polarity effect of Cu/Ni/Sn-Ag microbumps for three-dimensional integrated circuits
Conference
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-3 Dec, 2017
Academic Journal
Electronic Materials Letters; Sep2022, Vol. 18 Issue 5, p431-439, 9p
Academic Journal
Journal of Materials Science: Materials in Electronics; Aug2022, Vol. 33 Issue 22, p17493-17501, 9p
Academic Journal
Journal of Materials Science: Materials in Electronics; Aug2021, Vol. 32 Issue 15, p20559-20569, 11p
Academic Journal
Electronic Materials Letters; Mar2021, Vol. 17 Issue 2, p157-163, 7p
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[AR] Son, Kirak
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