학술논문
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Academic Journal
In Microelectronic Engineering 1 August 2024 291
Academic Journal
Delwail, C.; Joblot, S.; Mazen, F.; Abbate, F.; Lachal, L.; Milesi, F.; Bertoglio, M.; Papon, A.M.; Gregoire, M.; Rodriguez, P.H.; Mangelinck, D.
In Microelectronic Engineering 1 February 2022 254
Academic Journal
Guillemin, S.; Gergaud, P.; Bernier, N.; Lachal, L.; Mazen, F.; Jannaud, A.; Nemouchi, F.; Rodriguez, Ph.
In Microelectronic Engineering 1 May 2021 244-246
Academic Journal
Lachal, L.; Plantier, C.; Pedini, J.M.; Coig, M.; Milesi, F.; Mazen, F.; Torregrosa, F.; Aubert, C.; Borvon, G.
In: MRS Advances . (MRS Advances, December 2022, 7(36):1390-1394)
Conference
Segaud, R.; Aumont, C.; Eleouet, R.; Allouti, N.; Mourier, T.; Gabette, L.; Minoret, S.; Magis, T.; Roman, A.; Hida, R.; Ratin, C.; Lachal, L.; Delachanal, S.; Cordini, M. L.; Nardi, P.; Feldis, H.; Charpentier, A.; Chausse, P.; Laviron, C.; Cheramy, S.
2013 Eurpoean Microelectronics Packaging Conference (EMPC) Microelectronics Packaging Conference (EMPC) , 2013 European. :1-6 Sep, 2013
Conference
Barlas, M.; Grossi, A.; Grenouillet, L.; Vianello, E.; Nolot, E.; Vaxelaire, N.; Blaise, P.; Traore, B.; Coignus, J.; Perrin, F.; Crochemore, R.; Mazen, F.; Lachal, L.; Pauliac, S.; Pellissier, C.; Bernasconi, S.; Chevalliez, S.; Nodin, J. F.; Perniola, L.; Nowak, E.
2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :14.6.1-14.6.4 Dec, 2017
Conference
Micout, J.; Lapras, V.; Batude, P.; Fenouillet-Beranger, C.; Lacord, J.; Sklenard, B.; Mathieu, B.; Rafhay, Q.; Mazzocchi, V.; Colinge, J.-P.; Lachal, L.; Garros, X.; Casse, M.; Toffoli, A.; Romano, G.; Allain, F.; Brunet, L.; Hartmann, J.-M.; Bortolin, R.; Mazen, F.; Barraud, S.; Rambal, N.; Tabone, C.; Samson, M.-P.; Besombes, P.; Delaye, V.; Saghi, Z.; Loup, V.; Comboroure, C.; Balan, V.; Desvoivres, L.; Vizioz, C.; Ghibaudo, G.; Vinet, M.
2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :32.2.1-32.2.4 Dec, 2017
Conference
Le Royer, C.; Pouydebasque, A.; Romanjek, K.; Barral, V.; Vinet, M.; Hartmann, J.-M.; Augendre, E.; Grampeix, H.; Lachal, L.; Tabone, C.; Previtali, B.; Truche, R.; Allain, F.
2009 International Symposium on VLSI Technology, Systems, and Applications VLSI Technology, Systems, and Applications, 2009. VLSI-TSA '09. International Symposium on. :145-146 Apr, 2009
Conference
In: 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Proceedings , 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Proceedings. (2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Proceedings, 2023)
Academic Journal
Milési, F.; Coig, M.; Lerat, J.-F.; Desrues, T.; Le Perchec, J.; Lanterne, A.; Lachal, L.; Mazen, F.
In: Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms . (Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms, 15 October 2017, 409:53-59)
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[AR] Lachal, L.
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