학술논문
28nm FDSOI CMOS technology (FEOL and BEOL) thermal stability for 3D Sequential Integration: Yield and reliability analysis
Document Type
Conference Paper
Author
Cavalcante, C.; Fenouillet-Beranzer, C.; Batude, P.; Garros, X.; Lacord, J.; Kerdiles, S.; Royet, A.-S.; Acosta-Alba, P.; Rozeau, O.; Barral, V.; Guerin, C.; Arnaud, L.; Moreau, S.; Kies, R.; Romano, G.; Rambal, N.; Magalhaes, A.; Colinag, J.-P.; Vinet, M.; Andrieu, F.; Ghibaudo, G.; Federspiel, X.; Arnaud, F.; Planes, N.; Sassoulas, P.-O.; Ghegin, E.; Beneyton, R.; Gregoire, M.; Weber, O.
Source
In: Digest of Technical Papers - Symposium on VLSI Technology , 2020 IEEE Symposium on VLSI Technology, VLSI Technology 2020 - Proceedings. (Digest of Technical Papers - Symposium on VLSI Technology, June 2020, 2020-June)
Subject
Language
English
ISSN
07431562