학술논문
'학술논문'
에서 검색결과 274건 | 목록
10~20
Academic Journal
In Journal of Biological Chemistry March 2024 300(3) Supplement
Academic Journal
In Journal of Biological Chemistry March 2024 300(3) Supplement
Conference
Moloudi, Reza; Grun, Tobias; Verleysen, Willem; Vandevelde, Bart; Cleuren, Silke G.C.; May, Daniel; Wunderle, Bernhard
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023
Conference
Grun, Tobias; May, Daniel; Straub, Hubert; Jakub, Gromala Przemyslaw; Verleysen, Willem; Wunderle, Bernhard
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-5 Apr, 2023
Academic Journal
In Land Use Policy March 2019 82:317-327
Conference
May, Daniel; Jbari, Kenza; Carisetti, Dominique; Borta-Boyon, Ana; Garabedian, Patrick; Ziaei, Afshin; Ras, Mohamad Abo; Wunderle, Bernhard
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-7 Sep, 2022
Conference
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-8 Sep, 2022
Conference
Grosse-Kockert, Corinna; Ras, Mohamad Abo; May, Daniel; Cremieux-Trives, Alexandre; Loffler, Florian; Wunderle, Bernhard
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-5 Sep, 2022
Academic Journal
In Microelectronics Reliability July 2017 74:136-146
Academic Journal
Broderick, Mark K.; Yang, Congqi; Pike, Robert D.; Nicholas, Aaron; May, Daniel; Patterson, Howard H.
In Polyhedron 16 August 2016 114:333-343
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[AR] May, Daniel
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