학술논문
'학술논문'
에서 검색결과 298건 | 목록
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Academic Journal
In Results in Engineering September 2025 27
Academic Journal
In Microelectronics Reliability August 2025 171
Academic Journal
Rajendran, Dhivakar ; Missaoui, Sarra ; Stiller, Jonas ; Ramalingame, Rajarajan ; Zschenderlein, Uwe ; Wunderle, Bernhard ; Nestler, Daisy ; Kanoun, Olfa
In Ceramics International May 2025
Academic Journal
Ayadi, Mohamed Dhia; Naifar, Slim; Khlif, Mohamed; Zouari, Bassem; Zschenderlein, Uwe; Wunderle, Bernhard; Kanoun, Olfa
In Journal of Alloys and Compounds 15 December 2024 1008
Academic Journal
In Microelectronics Reliability December 2024 163
Conference
Boldeiu, George; Nicoloiu, Alexandra; Mohammadi, Arash; Nastase, Claudia; Nedelcu, Monica; Zdru, Ioana; Vasilache, Dan; Dinescu, Adrian; Wunderle, Bernhard; Muller, Alexandru
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025 26th International Conference on. :1-6 Apr, 2025
Conference
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025 26th International Conference on. :1-5 Apr, 2025
Conference
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025 26th International Conference on. :1-7 Apr, 2025
Conference
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025 26th International Conference on. :1-5 Apr, 2025
Conference
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025 26th International Conference on. :1-9 Apr, 2025
Conference
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025 26th International Conference on. :1-7 Apr, 2025
Conference
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025 26th International Conference on. :1-8 Apr, 2025
Academic Journal
In Microelectronics Reliability June 2023 145
Conference
2024 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2024 30th International Workshop on. :1-10 Sep, 2024
Conference
2024 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2024 30th International Workshop on. :1-8 Sep, 2024
Conference
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2024 IEEE 10th. :1-9 Sep, 2024
Academic Journal
Bagetti Jeronimo, Mateus; Schindele, Jens; Straub, Hubert; Gromala, Przemyslaw Jakub; Wunderle, Bernhard; Zimmermann, André
In Microelectronics Reliability January 2023 140
Academic Journal
In Microelectronics Reliability December 2022 139
Academic Journal
In Microelectronics Reliability November 2022 138
Conference
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-10 Apr, 2024
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[AR] Wunderle, Bernhard
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