학술논문

Enhanced Thermal Confinement in Phase-Change Memory Targeting Current Reduction
Document Type
Conference
Source
ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2022 - IEEE 52nd European. :233-236 Sep, 2022
Subject
Components, Circuits, Devices and Systems
Phase change materials
Phased arrays
Silicon carbide
Thermal resistance
Conductivity
Programming
Thermal conductivity
Language
Abstract
In this work, we present the extensive electrical characterization of 4kb Phase-Change Memory (PCM) arrays based on “Wall” structure and Ge-rich GeSbTe (GST) material, integrating a SiC dielectric with low thermal conductivity surrounding the heater element for enhanced cell thermal efficiency. We investigate the effects of the introduction of such dielectrics on the electrical performances of the device and we provide a promising path to achieve energy-efficient PCM cells supporting our results by electro-thermal TCAD simulations.