학술논문
Future challenges and opportunities for heterogeneous process technology. Towards the thin films, Zero Intrinsic Variability devices, Zero Power era
Document Type
Conference
Author
Deleonibus, S.; Faynot, O.; Ernst, T.; Vinet, M.; Batude, P.; Andrieu, F.; Weber, O.; Cooper, D.; Bertin, F.; Moriceau, H.; DiCioccio, L.; Signamarcheix, T.; Sanquer, M.; Jehl, X.; Cueto, O.; Fanet, H.; Martin, F.; Okuno, H.; Nemouchi, F.; Poupon, G.; Lamy, Y.; Gasparutto, D.; Baillin, X.; Duraffourg, L.; Arcamone, J.; Perniola, L.; de Salvo, B.; Vianello, E.; Hutin, L.; Poulain, C.; Beigne, E.; Tiron, R.; Pain, L.; Tedesco, S.; Barnola, S.; Posseme, N.; Le Royer, C.; Villalon, A.; Salot, R.
Source
2014 IEEE International Electron Devices Meeting Electron Devices Meeting (IEDM), 2014 IEEE International. :9.2.1-9.2.4 Dec, 2014
Subject
Language
ISSN
0163-1918
2156-017X
2156-017X
Abstract
Linear scaling CMOS has encountered many hurdles which request new process modules, driven mainly by the maximization of energy efficiency. Fabrication at the sub 10nm node level will request Intrinsic Variability approaching to zero. The rapid growth of mobile, multifunctional and autonomous systems is hardly demanding to reach Zero Power consumption. The solutions to integrate Thin Film based devices, architectures and systems in order to face these challenges are described.