학술논문
Limitations and accuracy of steady state technique for thermal characterization of thermal interface materials and substrates
Document Type
Conference
Author
Source
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on. :1285-1293 May, 2014
Subject
Language
ISSN
1087-9870
Abstract
The steady state method is a commonly used and in principle simple way to measure thermal resistance and conductivity of thermal interface materials (TIMs). The sample must be positioned between a hot and a cold plate with constant temperatures, whereby a heat flow through the sample and temperature gradient across the sample are generated. To determine the thermal resistance of the sample the heat flow and the temperature gradient have to be measured. This is also defined by the ASTM standard ASTM D5470 [4].