학술논문

Multi-purpose Thermal Test Vehicle for Experimental Investigation on Pumped Two-Phase Cooling
Document Type
Conference
Source
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-7 Apr, 2024
Subject
Components, Circuits, Devices and Systems
Computing and Processing
Photonics and Electrooptics
Power, Energy and Industry Applications
Micromechanical devices
Cooling
Water heating
Packaging
Electronic packaging thermal management
Pins
Topology
Language
ISSN
2833-8596
Abstract
Flow boiling heat transfer to water of different cooler surface topologies is experimentally investigated. To have the possibility for investigations of new electronic packages that supports cooling solutions by two-phase flow boiling, a multipurpose closed two-phase flow boiling cooling test stand for rapid experimental characterization and parameter variation is designed. The designed test vehicle holds interchangeable, plug-in heating module that offers the possibility to investigate different cooler structures and surface topologies/chemistry to improve the formation and release of small bubbles. In order to have a proof of concept for the test stand and to show its reproducible to those given in the literature, initially, the investigation is limited to a plain-and dimpled-surface and a pin fin and finned cooler structure in the mm range.