부산대학교 도서관

High-Performance Computing (HPC) is already becoming an essential part of many engineering fields, and automotive sector is no exception. With the autonomous driving becoming rapidly the new technological forefront in automotive ecosystem, new peaks in computing power in automobiles will be seen, and relying only on material developments to push this front further might prove to be in vain. It is therefore essential to come up with solutions to address the new challenges rising, such as increasing power densities and thermo-mechanical loads at a system level. To that end, we propose a new modular approach to standard lidded packaging that aims to achieve better thermo-mechanical performance and acts as a reworkable thermal plug. This approach is called CoolStar, where a fractal heat spreader is attached to the liquid cooler with a ultra-low modulus, gel-like gap-filter. Proof-of-concept is presented in this paper, showing that the approach is promising addressing thermo-mechanical stresses at the system level. The idea can also be installed and tested in real-life applications, and further numerical studies along with experimental validation of the concept is essential.