학술논문

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발행년	- (예 : 2010-2015)

전체선택

Medical schools in Africa: seeing momentum

Academic Journal

Rosenberg, J.; Juvonen, M.; Ng, M.Z.; Arinzeh, N.; Pellegrom, S.; Weintraub, R.; Adanu, T.S.A.; Ninsiima, H.; Temesgen, R.; Ajuwon, G.; Abiodun-Asanre, O.A.; Hailu, T.

In: BMJ Global Health. (BMJ Global Health, 22 February 2024, 9(2))

Open Access (EBSCO) Web of Science JCR 저널정보 Scopus Find it@PNU

Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects

Academic Journal

Dai, Y.Y.; Anantha, P.; Lin, Y.D.; Tan, C.S.; Ng, M.Z.; Li, Z.G.; Gan, C.L.

In: Applied Physics Letters. (Applied Physics Letters, 27 June 2016, 108(26))

Full Text (AIP) Web of Science JCR 저널정보 Scopus Find it@PNU

Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect

Academic Journal

Chun, S.R.; Sasangka, W.A.; Ng, M.Z.; Gan, C.L.; Du, A.; Zhu, J.; Ng, C.M.; Liu, Z.Q.; Liu, Q.; Chiam, S.Y.

In: Small. (Small, 12 August 2013, 9(15):2546-2552)

Full Text (Wiley Journals) Full Text (Wiley-DB) Web of Science JCR 저널정보 Scopus Find it@PNU

The impact of film deposition temperature and bottom liner on the hardness and grain size of al films investigated using Nanoindentation and SEM Techniques

Conference

Li, X.; Zru, X.; Nistala, R.R.; Mo, Z.Q.; Ng, M.Z.; Seet, C.S.

In: Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, IPFA 2018 - 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, 30 August 2018, 2018-July)

Full Text (IEEE) Scopus Find it@PNU

Application of copper nanoparticles as die attachment for high power LED

Conference

Lee, B.H.; Ng, M.Z.; Gan, C.L.; Zinn, A.A.

In: Proceedings of the Electronic Packaging Technology Conference, EPTC, 2015 IEEE 17th Electronics Packaging and Technology Conference, EPTC 2015. (Proceedings of the Electronic Packaging Technology Conference, EPTC, 17 February 2016, 2016-February)

Scopus Find it@PNU

Copper micro and nano particles mixture for 3D interconnections application

Conference

Dai, Y.Y.; Anantha, P.; Tan, C.S.; Ng, M.Z.; Gan, C.L.

In: 2015 International 3D Systems Integration Conference, 3DIC 2015, 2015 International 3D Systems Integration Conference, 3DIC 2015. (2015 International 3D Systems Integration Conference, 3DIC 2015, 20 November 2015, :TS8.9.1-TS8.9.5)

Full Text (IEEE) Scopus Find it@PNU

Evaluation of copper nanoparticles for low temperature bonded interconnections

Conference

Lee, B.H.; Ng, M.Z.; Gan, C.L.; Zinn, A.A.

In: Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, 25 August 2015, 2015-August:102-106)

Full Text (IEEE) Scopus Find it@PNU

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