학술논문

Investigations of under/overpolish parameters that influence local and global topography at the 65nm technology node
Document Type
Conference Paper
Source
In: 2007 Proceedings - 12th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2007, 2007 Proceedings - 12th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2007. (2007 Proceedings - 12th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2007, 2007, :480-483)
Subject
Language
English