학술논문
W CMP process integration
Document Type
Conference
Author
Source
European Workshop Materials for Advanced Metallization, Materials for advanced metallization Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop. :86-87 1997
Subject
Language
ISSN
1266-0167
Abstract
As integrated circuit devices continue to scale towards smaller geometry, the requirements imposed on the advanced metallization become increasingly stringent: high degree of planarity, low defectivity level, high device yield. Since etch back tungsten introduces many particles and recess, tungsten CMP appears as a very promising technology for new generation of ULSI devices. This work reports a characterisation of W CMP process using different slurries.