학술논문

Effects of Layer-to-Layer Coupling on the Total-Ionizing-Dose Response of 3-D-Sequentially Integrated FD-SOI MOSFETs
Document Type
Periodical
Source
IEEE Transactions on Nuclear Science IEEE Trans. Nucl. Sci. Nuclear Science, IEEE Transactions on. 69(7):1420-1427 Jul, 2022
Subject
Nuclear Engineering
Bioengineering
Couplings
Radiation effects
MOSFET
Design automation
Annealing
Silicon-on-insulator
Logic gates
3-D integration
coupling effects
fully depleted (FD)
irradiation
silicon-on-insulator (SOI)
technology computer-aided design (TCAD) simulations
total ionizing (TID)
Language
ISSN
0018-9499
1558-1578
Abstract
Total-ionizing-dose (TID) responses are investigated for 3-D-sequentially integrated fully depleted silicon-on-insulator (FD-SOI) MOSFETs. Strong layer-to-layer coupling of TID response is observed. The simultaneous application of positive bias to the gate of the bottom-layer device and negative bias to the top-layer device leads to the maximum enhancement of positive charge trapping in the top-layer device and the intermediate dielectric layer. This enhancement is due to the upward-directed electric field in the intermediate dielectric layer under these bias conditions. In contrast, electrostatic shielding prevents the gate bias of the top-layer device from affecting the response of the bottom-layer device, as confirmed by experiments and technology computer-aided design (TCAD) simulations. Effects of layer-to-layer coupling are less significant for postirradiation-biased annealing.