부산대학교 도서관

Hu, L.S.; Fattori, M.; Schilp, W.; Verbeek, R.; Kazemzadeh, S.; van de Burgt, Y.; Kronemeijer, A.J.; Gelinck, G.; Cantatore, E.

IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(12):6520-6525 Dec, 2023

Muganda, J.M.; Jansen, B.; Homburg, E.; van de Burgt, Y.; den Toonder, J.

IEEE Transactions on Automation Science and Engineering IEEE Trans. Automat. Sci. Eng. Automation Science and Engineering, IEEE Transactions on. 19(2):994-1002 Apr, 2022

Van Charldorp, T.C. ; Strick, M.A. ; de Grauw, J.C. ; Brugman, S. ; Van de Burgt, Y. ; Winkens, L.H.H. ; Meye, F.J. ; Rijsdijk, M. ; Willemen, H.L.D.M.

In PEC Innovation 15 December 2024 5

Gkoupidenis, P.; Zhang, Y.; Kleemann, H.; Ling, H.; Santoro, F.; Fabiano, S.; Salleo, A.; van de Burgt, Y.

Nature Reviews Materials. 9(2):134-149

De Vries, S.; Degan, C.; Tobin, R.; Jimenéz-Requena, A.; Ajeenah, A.; Johansson, C.; Van der Burgt, Y.; Diaz-Manera, J.; Guglieri, M.; Szigyarto, C. Al-Khalili; Spitali, P.; Hathout, Y.; Tsonaka, R.; Dang, U.

Neuromuscular Disorders. 43

Carrasco, A. Jiménez-Requena; Ajeenah, A.; Johansson, C.; Naveed, A.; Tobin, R.; Degan, C.; de Vries, S.; van der Burgt, Y.; Diaz-Manera, J.; Guglieri, M.; Dang, U.; Tsonaka, R.; Spitali, P.; Hathout, Y.; Szigyarto, C. Al-Khalili

Neuromuscular Disorders. 43

van Doremaele, E. R. W.; Ji, X.; Rivnay, J.; van de Burgt, Y.

Nature Electronics. 6(10):765-770

Broos, Jelle Y.; van der Burgt, Rianne T. M.; Konings, Julia; Rijnsburger, Merel; Werz, Oliver; de Vries, Helga E.; Giera, Martin; Kooij, Gijs

Journal of Neuroinflammation. 21(1)

Wang S; Department of Applied Physics, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Joint Research Centre of Microelectronics, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Research Institute for Artificial Intelligence of Things, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Li Z; Department of Applied Physics, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Joint Research Centre of Microelectronics, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Research Institute for Artificial Intelligence of Things, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Pei M; Department of Applied Physics, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Joint Research Centre of Microelectronics, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Research Institute for Artificial Intelligence of Things, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Ren Q; Department of Applied Physics, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Joint Research Centre of Microelectronics, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Research Institute for Artificial Intelligence of Things, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Deng M; Department of Applied Physics, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Joint Research Centre of Microelectronics, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Research Institute for Artificial Intelligence of Things, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Ang KW; Department of Electrical and Computer Engineering, National University of Singapore, Singapore 119077, Singapore.; Ascoli A; Department of Electronics and Telecommunications, Politecnico di Torino, Turin 10129, Italy.; Banerjee S; Laboratory for Inorganic Chemistry, Department of Chemistry and Applied Biosciences, ETH Zürich, Zürich 8093, Switzerland.; Laboratory for Battery Science, PSI Center for Energy and Environmental Sciences, Paul Scherrer Institute, Villigen 5232, Switzerland.; Bonnin M; Department of Electronics and Telecommunications, Politecnico di Torino, Turin 10129, Italy.; van de Burgt Y; Department of Mechanical Engineering, Eindhoven University of Technology, Eindhoven 5612AJ, Netherlands.; Institute for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven 5612AJ, Netherlands.; Cheng B; Microelectronics Thrust, The Hong Kong University of Science and Technology (Guangzhou), Guangzhou 511453, China.; Chua L; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, California 94720, United States.; Civalleri PP; Department of Electronics and Telecommunications, Politecnico di Torino, Turin 10129, Italy.; Corinto F; Department of Electronics and Telecommunications, Politecnico di Torino, Turin 10129, Italy.; Cui TJ; State Key Laboratory of Millimeter Waves, Southeast University, Nanjing 210096, China.; Das S; Engineering Science and Mechanics, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Demirkol AS; Institut für Grundlagen der Elektrotechnik und Elektronik, Technische Universität Dresden, Dresden 01069, Germany.; van Dijken S; Department of Applied Physics, Aalto University School of Science, P.O. Box 15100, Aalto FI-00076, Finland.; Fan Y; School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits, BNRist, Tsinghua University, Beijing 100084, China.; Fang L; Department of Electronic Engineering, Tsinghua University, Beijing 100084, China.; Farronato M; Dipartimento di Elettronica, Informazione e Bioingegneria, Politecnico di Milano and IU.NET, Milano 20133, Italy.; Feng ZR; State Key Laboratory of Millimeter Waves, Southeast University, Nanjing 210096, China.; Gemo E; Department of Electronics and Telecommunications, Politecnico di Torino, Turin 10129, Italy.; Gilli M; Department of Electronics and Telecommunications, Politecnico di Torino, Turin 10129, Italy.; Goswami S; Centre for Nanoscience and Engineering, Indian Institute of Science, Bangalore 560012, India.; He Y; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan 430074, China.; Shenzhen Loop Area Institute, Shenzhen 518038, China.; Huang C; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong 999077, China.; Huang Q; School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits, Peking University, Beijing 100871, China.; Hwang CS; Department of Materials Science and Engineering, and Inter-University Semiconductor Research Center, College of Engineering, Seoul National University, Seoul 08826, Republic of Korea.; Ielmini D; Dipartimento di Elettronica, Informazione e Bioingegneria, Politecnico di Milano and IU.NET, Milano 20133, Italy.; Jang YH; Department of Materials Science and Engineering, College of Engineering, Yonsei University, Seoul 03722, Republic of Korea.; Kuncic Z; School of Physics and Sydney Nano Institute, University of Sydney, Sydney, New South Wales 2006, Australia.; Lemme MC; Chair of Electronic Devices, RWTH Aachen University, Aachen 52062, Germany.; AMO GmbH, Aachen 52074, Germany.; Li C; Department of Electrical and Electronic Engineering, The University of Hong Kong, Hong Kong 999077, China.; Centre for Advanced Semiconductors and Integrated Circuits, The University of Hong Kong, Hong Kong 999077, China.; Liang SJ; Institute of Brain-Inspired Intelligence, National Laboratory of Solid State Microstructures, School of Physics, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.; Chemistry and Biomedicine Innovation Center, Nanjing University, Nanjing 200023, China.; Liu K; School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits, Peking University, Beijing 100871, China.; Guangdong Provincial Key Laboratory of In-Memory Computing Chips, School of Electronic and Computer Engineering, Shenzhen Graduate School, Peking University, Shenzhen 518055, China.; Liu S; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong 999077, China.; Luo J; School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits, Peking University, Beijing 100871, China.; Ma Q; State Key Laboratory of Millimeter Waves, Southeast University, Nanjing 210096, China.; Maass W; Institute of Machine Learning and Neural Computation, Graz University of Technology, Graz A-8010, Austria.; Mannocci P; Dipartimento di Elettronica, Informazione e Bioingegneria, Politecnico di Milano and IU.NET, Milano 20133, Italy.; Messaris I; Institut für Grundlagen der Elektrotechnik und Elektronik, Technische Universität Dresden, Dresden 01069, Germany.; Miao F; Institute of Brain-Inspired Intelligence, National Laboratory of Solid State Microstructures, School of Physics, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.; Mikolajick T; NaMLab gGmbH, Dresden 01187, Germany.; Institut für Halbleiter- und Mikrosystemtechnik, Technische Universität Dresden, Dresden 01062, Germany.; Ntinas V; Institut für Grundlagen der Elektrotechnik und Elektronik, Technische Universität Dresden, Dresden 01069, Germany.; Ponis J; Laboratory for Inorganic Chemistry, Department of Chemistry and Applied Biosciences, ETH Zürich, Zürich 8093, Switzerland.; Laboratory for Battery Science, PSI Center for Energy and Environmental Sciences, Paul Scherrer Institute, Villigen 5232, Switzerland.; Prodromakis T; Centre for Electronics Frontiers, Institute for Integrated Micro and Nano Systems, School of Engineering, University of Edinburgh, Edinburgh EH8 9YL, U.K.; Prousalis D; Institut für Grundlagen der Elektrotechnik und Elektronik, Technische Universität Dresden, Dresden 01069, Germany.; Shao Q; Department of Electronics and Computer Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong 999077, China.; AI Chip Center for Emerging Smart Systems, Hong Kong Science Park, Hong Kong, New Territories 999077, China.; Department of Physics, The Hong Kong University of Science and Technology, Kowloon, Hong Kong 999077, China.; Slesazeck S; NaMLab gGmbH, Dresden 01187, Germany.; Strachan JP; Peter Grünberg Institute 14, Forschungszentrum Jülich GmbH, Jülich 52428, Germany.; RWTH Aachen University, Aachen 52062, Germany.; Tan H; Max Planck Institute for Polymer Research, Mainz 55128, Germany.; Tang J; School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits, BNRist, Tsinghua University, Beijing 100084, China.; Tetzlaff R; Institut für Grundlagen der Elektrotechnik und Elektronik, Technische Universität Dresden, Dresden 01069, Germany.; Tran LPL; Department of Mechanical Engineering, Eindhoven University of Technology, Eindhoven 5612AJ, Netherlands.; Institute for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven 5612AJ, Netherlands.; Valov I; Peter Grünberg Institute 7 and JARA-FIT, Forschungszentrum Jülich, Jülich 52428, Germany.; Institute of Electrochemistry and Energy Systems, Bulgarian Academy of Sciences, Sofia 1113, Bulgaria.; Vorias A; Department of Mechanical Engineering, Eindhoven University of Technology, Eindhoven 5612AJ, Netherlands.; Institute for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven 5612AJ, Netherlands.; Wang B; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong 999077, China.; Wang J; Center for Alloy Innovation and Design, State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China.; Wang S; Department of Electrical and Electronic Engineering, The University of Hong Kong, Hong Kong 999077, China.; Centre for Advanced Semiconductors and Integrated Circuits, The University of Hong Kong, Hong Kong 999077, China.; Wang X; Center for Alloy Innovation and Design, State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China.; Wang Y; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan 430074, China.; Wu H; School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits, BNRist, Tsinghua University, Beijing 100084, China.; Xia Q; Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, Massachusetts 01003, United States.; Xiao K; Department of Biomedical Engineering, Southern University of Science and Technology, Shenzhen 518055, China.; Xiao Z; Department of Electronics and Computer Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong 999077, China.; AI Chip Center for Emerging Smart Systems, Hong Kong Science Park, Hong Kong, New Territories 999077, China.; Xiong Z; Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, Massachusetts 01003, United States.; Xu T; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong 999077, China.; Yang MJ; Peter Grünberg Institute 14, Forschungszentrum Jülich GmbH, Jülich 52428, Germany.; Yang Y; School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits, Peking University, Beijing 100871, China.; Guangdong Provincial Key Laboratory of In-Memory Computing Chips, School of Electronic and Computer Engineering, Shenzhen Graduate School, Peking University, Shenzhen 518055, China.; Yang Y; Institute of Brain-Inspired Intelligence, State Key Laboratory for Novel Software Technology, School of Intelligence Science and Technology, Nanjing University, Suzhou 215163, China.; Zhang W; Center for Alloy Innovation and Design, State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China.; Chai Y; Department of Applied Physics, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Joint Research Centre of Microelectronics, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.; Research Institute for Artificial Intelligence of Things, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China.

Publisher: American Chemical Society Country of Publication: United States NLM ID: 101313589 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1936-086X (Electronic) Linking ISSN: 19360851 NLM ISO Abbreviation: ACS Nano Subsets: MEDLINE

Krauhausen, I; Griggs, S; McCulloch, I; den Toonder, JMJ; Gkoupidenis, P; van de Burgt, Y

Nat Commun
Nature Communications, Vol 15, Iss 1, Pp 1-9 (2024)
Nature Communications

van der Sluijs, Pleuntje J.; Jansen, Sandra; Vergano, Samantha A.; Adachi-Fukuda, Miho; Alanay, Yasemin; AlKindy, Adila; Baban, Anwar; Bayat, Allan; Beck-Wödl, Stefanie; Berry, Katherine; Bijlsma, Emilia K.; Bok, Levinus A.; Brouwer, Alwin F. J.; van der Burgt, Ineke; Campeau, Philippe M.; Canham, Natalie; Chrzanowska, Krystyna; Chu, Yoyo W. Y.; Chung, Brain H. Y.; Dahan, Karin; De Rademaeker, Marjan; Destree, Anne; Dudding-Byth, Tracy; Earl, Rachel; Elcioglu, Nursel; Elias, Ellen R.; Fagerberg, Christina; Gardham, Alice; Gener, Blanca; Gerkes, Erica H.; Grasshoff, Ute; van Haeringen, Arie; Heitink, Karin R.; Herkert, Johanna C.; den Hollander, Nicolette S.; Horn, Denise; Hunt, David; Kant, Sarina G.; Kato, Mitsuhiro; Kayserili, Hülya; Kersseboom, Rogier; Kilic, Esra; Krajewska-Walasek, Malgorzata; Lammers, Kylin; Laulund, Lone W.; Lederer, Damien; Lees, Melissa; López-González, Vanesa; Maas, Saskia; Mancini, Grazia M. S.; Marcelis, Carlo; Martinez, Francisco; Maystadt, Isabelle; McGuire, Marianne; McKee, Shane; Mehta, Sarju; Metcalfe, Kay; Milunsky, Jeff; Mizuno, Seiji; Moeschler, John B.; Netzer, Christian; Ockeloen, Charlotte W.; Oehl-Jaschkowitz, Barbara; Okamoto, Nobuhiko; Olminkhof, Sharon N. M.; Orellana, Carmen; Pasquier, Laurent; Pottinger, Caroline; Riehmer, Vera; Robertson, Stephen P.; Roifman, Maian; Rooryck, Caroline; Ropers, Fabienne G.; Rosello, Monica; Ruivenkamp, Claudia A. L.; Sagiroglu, Mahmut S.; Sallevelt, Suzanne C. E. H.; Sanchis Calvo, Amparo; Simsek-Kiper, Pelin O.; Soares, Gabriela; Solaeche, Lucia; Sonmez, Fatma Mujgan; Splitt, Miranda; Steenbeek, Duco; Stegmann, Alexander P. A.; Stumpel, Constance T. R. M.; Tanabe, Saori; Uctepe, Eyyup; Utine, G. Eda; Veenstra-Knol, Hermine E.; Venkateswaran, Sunita; Vilain, Catheline; Vincent-Delorme, Catherine; Vulto-van Silfhout, Anneke T.; Wheeler, Patricia; Wilson, Golder N.; Wilson, Louise C.; Wollnik, Bernd; Kosho, Tomoki; Wieczorek, Dagmar; Eichler, Evan; Pfundt, Rolph; de Vries, Bert B. A.; Clayton-Smith, Jill; Santen, Gijs W. E.

Genetics in Medicine: Official journal of the American College of Medical Genetics and Genomics. 21(6):1295-1307

Matrone GM; Microsystems, Institute for Complex Molecular Systems, Eindhoven University of Technology, 5612AJ, Eindhoven, The Netherlands. giovanni.matrone@northwestern.edu.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA. giovanni.matrone@northwestern.edu.; van Doremaele ERW; Microsystems, Institute for Complex Molecular Systems, Eindhoven University of Technology, 5612AJ, Eindhoven, The Netherlands.; Surendran A; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Laswick Z; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Griggs S; Department of Chemistry, Chemistry Research Laboratory, University of Oxford, Oxford, OX1 3TA, UK.; Ye G; Center for Biomedical Optics and Photonics (CBOP) & College of Physics and Optoelectronic Engineering, Key Laboratory of Optoelectronic Devices and Systems, Shenzhen University, Shenzhen, 518060, PR China.; McCulloch I; Department of Chemistry, Chemistry Research Laboratory, University of Oxford, Oxford, OX1 3TA, UK.; King Abdullah University of Science and Technology (KAUST), KAUST Solar Center (KSC), Thuwal, 23955-6900, Saudi Arabia.; Santoro F; Tissue Electronics, Istituto Italiano di Tecnologia, Naples, 80125, Italy.; Institute of Biological Information Processing IBI-3 Bioelectronics, Forschungszentrum Juelich, 52428, Juelich, Germany.; Neuroelectronic Interfaces, Faculty of Electrical Engineering and IT, RWTH Aachen, 52074, Aachen, Germany.; Rivnay J; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.; van de Burgt Y; Microsystems, Institute for Complex Molecular Systems, Eindhoven University of Technology, 5612AJ, Eindhoven, The Netherlands. Y.B.v.d.Burgt@tue.nl.

Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: MEDLINE

Rijsdijk M; Pain Clinic, Department of Anesthesiology, University Medical Center Utrecht, Utrecht University, Utrecht, the Netherlands. Electronic address: m.rijsdijk-2@umcutrecht.nl.; Smits HM; Center for Translational Immunology (CTI), University Medical Center Utrecht, Utrecht University, Utrecht, the Netherlands.; Azizoglu HR; Pain Clinic, Department of Anesthesiology, University Medical Center Utrecht, Utrecht University, Utrecht, the Netherlands.; Brugman S; Wageningen University and Research, Animal Sciences Group, Host Microbe Interactomics, Wageningen, the Netherlands.; van de Burgt Y; Microsystems, Institute for Complex Molecular Systems, Eindhoven University of Technology, the Netherlands.; van Charldorp TC; Languages, Literature and Communication, Faculty of Humanities, Utrecht University, Utrecht, the Netherlands.; van Gelder DJ; Consumption and Healthy Lifestyles Chair group, Wageningen University and Research, Wageningen, the Netherlands.; de Grauw JC; Department of Clinical Sciences and Services, Royal Veterinary College, Hatfield, United Kingdom; Department of Clinical Sciences, Faculty of Veterinary Medicine, Utrecht University, the Netherlands.; van Lange EA; Pain Clinic, Department of Anesthesiology, Erasmus Medical Center Rotterdam, the Netherlands.; Meye FJ; University Medical Center Utrecht, Department of Translational Neuroscience, Utrecht University, Utrecht, the Netherlands.; Strick M; Social, Health, and Organizational Psychology, Utrecht University, Utrecht, the Netherlands.; Walravens HWA; Pain Clinic, Department of Anesthesiology, University Medical Center Utrecht, Utrecht University, Utrecht, the Netherlands.; Winkens LHH; Consumption and Healthy Lifestyles Chair group, Wageningen University and Research, Wageningen, the Netherlands.; Huygen FJPM; Pain Clinic, Department of Anesthesiology, University Medical Center Utrecht, Utrecht University, Utrecht, the Netherlands; Pain Clinic, Department of Anesthesiology, Erasmus Medical Center Rotterdam, the Netherlands.; Drylewicz J; Center for Translational Immunology (CTI), University Medical Center Utrecht, Utrecht University, Utrecht, the Netherlands.; Willemen HLDM; Center for Translational Immunology (CTI), University Medical Center Utrecht, Utrecht University, Utrecht, the Netherlands.

Publisher: Churchill Livingstone Country of Publication: United States NLM ID: 100898657 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1528-8447 (Electronic) Linking ISSN: 15265900 NLM ISO Abbreviation: J Pain Subsets: MEDLINE

van der Sluijs, Pleuntje J.; Jansen, Sandra; Vergano, Samantha A.; Adachi-Fukuda, Miho; Alanay, Yasemin; AlKindy, Adila; Baban, Anwar; Bayat, Allan; Beck-Wödl, Stefanie; Berry, Katherine; Bijlsma, Emilia K.; Bok, Levinus A.; Brouwer, Alwin F. J.; van der Burgt, Ineke; Campeau, Philippe M.; Canham, Natalie; Chrzanowska, Krystyna; Chu, Yoyo W. Y.; Chung, Brain H. Y.; Dahan, Karin; De Rademaeker, Marjan; Destree, Anne; Dudding-Byth, Tracy; Earl, Rachel; Elcioglu, Nursel; Elias, Ellen R.; Fagerberg, Christina; Gardham, Alice; Gener, Blanca; Gerkes, Erica H.; Grasshoff, Ute; van Haeringen, Arie; Heitink, Karin R.; Herkert, Johanna C.; den Hollander, Nicolette S.; Horn, Denise; Hunt, David; Kant, Sarina G.; Kato, Mitsuhiro; Kayserili, Hülya; Kersseboom, Rogier; Kilic, Esra; Krajewska-Walasek, Malgorzata; Lammers, Kylin; Laulund, Lone W.; Lederer, Damien; Lees, Melissa; López-González, Vanesa; Maas, Saskia; Mancini, Grazia M. S.; Marcelis, Carlo; Martinez, Francisco; Maystadt, Isabelle; McGuire, Marianne; McKee, Shane; Mehta, Sarju; Metcalfe, Kay; Milunsky, Jeff; Mizuno, Seiji; Moeschler, John B.; Netzer, Christian; Ockeloen, Charlotte W.; Oehl-Jaschkowitz, Barbara; Okamoto, Nobuhiko; Olminkhof, Sharon N. M.; Orellana, Carmen; Pasquier, Laurent; Pottinger, Caroline; Riehmer, Vera; Robertson, Stephen P.; Roifman, Maian; Rooryck, Caroline; Ropers, Fabienne G.; Rosello, Monica; Ruivenkamp, Claudia A. L.; Sagiroglu, Mahmut S.; Sallevelt, Suzanne C. E. H.; Calvo, Amparo Sanchis; Simsek-Kiper, Pelin O.; Soares, Gabriela; Solaeche, Lucia; Sonmez, Fatma Mujgan; Splitt, Miranda; Steenbeek, Duco; Stegmann, Alexander P. A.; Stumpel, Constance T. R. M.; Tanabe, Saori; Uctepe, Eyyup; Utine, G. Eda; Veenstra-Knol, Hermine E.; Venkateswaran, Sunita; Vilain, Catheline; Vincent-Delorme, Catherine; Vulto-van Silfhout, Anneke T.; Wheeler, Patricia; Wilson, Golder N.; Wilson, Louise C.; Wollnik, Bernd; Kosho, Tomoki; Wieczorek, Dagmar; Eichler, Evan; Pfundt, Rolph; de Vries, Bert B. A.; Clayton-Smith, Jill; Santen, Gijs W. E.

Genetics in Medicine: Official journal of the American College of Medical Genetics and Genomics. 21(9):2160-2161

Kazemzadeh, S.; Stevens, T.; van de Burgt, Y.

In: Advanced Electronic Materials. (Advanced Electronic Materials, 2025)

van Doremaele ERW; Department of Mechanical Engineering and Institute for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven 5612AP, Netherlands.; Eindhoven Hendrik Casimir Institute, Eindhoven University of Technology, Eindhoven 5612AP, Netherlands.; Stevens T; Department of Mechanical Engineering and Institute for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven 5612AP, Netherlands.; Eindhoven Hendrik Casimir Institute, Eindhoven University of Technology, Eindhoven 5612AP, Netherlands.; Ringeling S; Department of Electrical Engineering, Eindhoven University of Technology, Eindhoven 5612AP, Netherlands.; Spolaor S; Department of Mechanical Engineering and Institute for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven 5612AP, Netherlands.; Fattori M; Eindhoven Hendrik Casimir Institute, Eindhoven University of Technology, Eindhoven 5612AP, Netherlands.; Department of Electrical Engineering, Eindhoven University of Technology, Eindhoven 5612AP, Netherlands.; van de Burgt Y; Department of Mechanical Engineering and Institute for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven 5612AP, Netherlands.; Eindhoven Hendrik Casimir Institute, Eindhoven University of Technology, Eindhoven 5612AP, Netherlands.

Publisher: American Association for the Advancement of Science Country of Publication: United States NLM ID: 101653440 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 2375-2548 (Electronic) Linking ISSN: 23752548 NLM ISO Abbreviation: Sci Adv Subsets: MEDLINE; PubMed not MEDLINE

Keene ST; Department of Materials Science and Engineering, Stanford University, Stanford, CA, 94305, USA.; van der Pol TPA; Molecular Materials and Nanosystems and Institute for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven, 5612AJ, Netherlands.; Zakhidov D; Department of Materials Science and Engineering, Stanford University, Stanford, CA, 94305, USA.; Weijtens CHL; Molecular Materials and Nanosystems and Institute for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven, 5612AJ, Netherlands.; Janssen RAJ; Molecular Materials and Nanosystems and Institute for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven, 5612AJ, Netherlands.; Salleo A; Department of Materials Science and Engineering, Stanford University, Stanford, CA, 94305, USA.; van de Burgt Y; Microsystems and Institute for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven, 5612AJ, Netherlands.

Publisher: Wiley-VCH Country of Publication: Germany NLM ID: 9885358 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1521-4095 (Electronic) Linking ISSN: 09359648 NLM ISO Abbreviation: Adv Mater Subsets: MEDLINE; PubMed not MEDLINE

Chen X; Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore. chenxd@ntu.edu.sg.; Hwang CS; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea. cheolsh@snu.ac.kr.; van de Burgt Y; Microsystems and Institure for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven, The Netherlands. Y.B.v.d.Burgt@tue.nl.; Santoro F; Center for Advanced Biomaterials for Healthcare, Istituto Italiano di Tecnologia, Largo Barsanti e Matteucci 53, Naples 80125, Italy.; Institute of Biological Information Processing - Bioelectronics, IBI-3, Forschungszentrum Jülich, Jülich, 52428, Germany. f.santoro@fz-juelich.de.; Neuroelectronic Interfaces, RWTH Aachen, Aachen, 52074, Germany.

Publisher: Royal Society of Chemistry Country of Publication: England NLM ID: 101623537 Publication Model: Electronic Cited Medium: Internet ISSN: 2051-6355 (Electronic) Linking ISSN: 20516347 NLM ISO Abbreviation: Mater Horiz Subsets: MEDLINE; PubMed not MEDLINE

Kurt I; Microsystems, Institute for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven, 5612 AE, The Netherlands.; Krauhausen I; Microsystems, Institute for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven, 5612 AE, The Netherlands.; Max Planck Institute for Polymer Research, 55128, Mainz, Germany.; Spolaor S; Microsystems, Institute for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven, 5612 AE, The Netherlands.; van de Burgt Y; Microsystems, Institute for Complex Molecular Systems, Eindhoven University of Technology, Eindhoven, 5612 AE, The Netherlands.

Publisher: WILEY-VCH Country of Publication: Germany NLM ID: 101664569 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 2198-3844 (Electronic) Linking ISSN: 21983844 NLM ISO Abbreviation: Adv Sci (Weinh) Subsets: MEDLINE

Y. van de Burgt; A. Champion; Y. Bellouard

AIP Advances, Vol 3, Iss 9, Pp 092119-092119-6 (2013)