부산대학교 도서관

Alemanno, F.; An, Q.; Azzarello, P.; Barbato, F. C. T.; Bernardini, P.; Bi, X. J.; Cagnoli, I.; Cai, M. S.; Casilli, E.; Catanzani, E.; Chang, J.; Chen, D. Y.; Chen, J. L.; Chen, Z. F.; Coppin, P.; Cui, M. Y.; Cui, T. S.; Cui, Y. X.; Dai, H. T.; De Benedittis, A.; De Mitri, I.; de Palma, F.; Di Giovanni, A.; Ding, Q.; Dong, T. K.; Dong, Z. X.; Donvito, G.; Droz, D.; Duan, J. L.; Duan, K. K.; Fan, R. R.; Fan, Y. Z.; Fang, F.; Fang, K.; Feng, C. Q.; Feng, L.; Frieden, J. M.; Fusco, P.; Gao, M.; Gargano, F.; Gong, K.; Gong, Y. Z.; Guo, D. Y.; Guo, J. H.; Han, S. X.; Hu, Y. M.; Huang, G. S.; Huang, X. Y.; Huang, Y. Y.; Ionica, M.; Jiang, L. Y.; Jiang, Y. Z.; Jiang, W.; Kong, J.; Kotenko, A.; Kyratzis, D.; Lei, S. J.; Li, W. H.; Li, W. L.; Li, X.; Li, X. Q.; Liang, Y. M.; Liu, C. M.; Liu, H.; Liu, J.; Liu, S. B.; Liu, Y.; Loparco, F.; Luo, C. N.; Ma, M.; Ma, P. X.; Ma, T.; Ma, X. Y.; Marsella, G.; Mazziotta, M. N.; Mo, D.; Niu, X. Y.; Pan, X.; Parenti, A.; Peng, W. X.; Peng, X. Y.; Perrina, C.; Putti-Garcia, E.; Qiao, R.; Rao, J. N.; Ruina, A.; Sarkar, R.; Savina, P.; Serpolla, A.; Shangguan, Z.; Shen, W. H.; Shen, Z. Q.; Shen, Z. T.; Silveri, L.; Song, J. X.; Stolpovskiy, M.; Su, H.; Su, M.; Sun, H. R.; Sun, Z. Y.; Surdo, A.; Teng, X. J.; Tykhonov, A.; Wang, J. Z.; Wang, L. G.; Wang, S.; Wang, S. X.; Wang, X. L.; Wang, Y.; Wang, Y. F.; Wang, Y. Z.; Wang, Z. M.; Wei, D. M.; Wei, J. J.; Wei, Y. F.; Wu, D.; Wu, J.; Wu, S. S.; Wu, X.; Xia, Z. Q.; Xu, H. T.; Xu, J.; Xu, Z. H.; Xu, Z. L.; Xu, E. H.; Xu, Z. Z.; Xue, G. F.; Yang, H. B.; Yang, P.; Yang, Y. Q.; Yao, H. J.; Yu, Y. H.; Yuan, G. W.; Yuan, Q.; Yue, C.; Zang, J. J.; Zhang, S. X.; Zhang, W. Z.; Zhang, Yan; Zhang, Yi; Zhang, Y. J.; Zhang, Y. L.; Zhang, Y. P.; Zhang, Y. Q.; Zhang, Z.; Zhang, Z. Y.; Zhao, C.; Zhao, H. Y.; Zhao, X. F.; Zhou, C. Y.; Zhu, Y.

Zhao, J. W.; Sun, B. -H.; Tanihata, I.; Xu, J. Y.; Zhang, K. Y.; Prochazka, A.; Zhu, L. H.; Terashima, S.; Meng, J.; He, L. C.; Liu, C. Y.; Li, G. S.; Lu, C. G.; Lin, W. J.; Lin, W. P.; Liu, Z.; Ren, P. P; Sun, Z. Y.; Wang, F.; Wang, J.; Wang, M.; Wang, S. T.; Wei, X. L.; Xu, X. D.; Zhang, J. C.; Zhang, M. X; Zhang, X. H.

Huang, Y.; Xia, S. Y.; Li, Y. F.; Tu, X. L.; Zhang, J. T.; Shao, C. J.; Yue, K.; Ma, P.; Niu, Y. F.; Li, Z. P.; Kuang, Y.; Liu, X. Q.; Han, J. F.; Egelhof, P.; Litvinov, Yu. A.; Wang, M.; Zhang, Y. H.; Zhou, X. H.; Sun, Z. Y.

Zhao, J. W.; Sun, B. -H.; Tanihata, I.; Terashima, S.; Prochazka, A.; Xu, J. Y.; Zhu, L. H.; Meng, J.; Su, J.; Zhang, K. Y.; Geng, L. S.; He, L. C.; Liu, C. Y.; Li, G. S.; Lu, C. G.; Lin, W. J.; Lin, W. P.; Liu, Z.; Ren, P. P; Sun, Z. Y.; Wang, F.; Wang, J.; Wang, M.; Wang, S. T.; Wei, X. L.; Xu, X. D.; Zhang, J. C.; Zhang, M. X; Zhang, X. H.

Phys. Lett. B 847 (2023) 138269

DAMPE Collaboration; Alemanno, F.; Altomare, C.; An, Q.; Azzarello, P.; Barbato, F. C. T.; Bernardini, P.; Bi, X. J.; Cagnoli, I.; Cai, M. S.; Casilli, E.; Catanzani, E.; Chang, J.; Chen, D. Y.; Chen, J. L.; Chen, Z. F.; Coppin, P.; Cui, M. Y.; Cui, T. S.; Cui, Y. X.; Dai, H. T.; De Benedittis, A.; De Mitri, I.; de Palma, F.; Deliyergiyev, M.; Di Giovanni, A.; Di Santo, M.; Ding, Q.; Dong, T. K.; Dong, Z. X.; Donvito, G.; Droz, D.; Duan, J. L.; Duan, K. K.; Fan, R. R.; Fan, Y. Z.; Fang, F.; Fang, K.; Feng, C. Q.; Feng, L.; Alonso, M. Fernandez; Frieden, J. M.; Fusco, P.; Gao, M.; Gargano, F.; Gong, K.; Gong, Y. Z.; Guo, D. Y.; Guo, J. H.; Han, S. X.; Hu, Y. M.; Huang, G. S.; Huang, X. Y.; Huang, Y. Y.; Ionica, M.; Jiang, L. Y.; Jiang, Y. Z.; Jiang, W.; Kong, J.; Kotenko, A.; Kyratzis, D.; Lei, S. J.; Li, W. H.; Li, W. L.; Li, X.; Li, X. Q.; Liang, Y. M.; Liu, C. M.; Liu, H.; Liu, J.; Liu, S. B.; Liu, Y.; Loparco, F.; Luo, C. N.; Ma, M.; Ma, P. X.; Ma, T.; Ma, X. Y.; Marsella, G.; Mazziotta, M. N.; Mo, D.; Salinas, M. Muñoz; Niu, X. Y.; Pan, X.; Parenti, A.; Peng, W. X.; Peng, X. Y.; Perrina, C.; Putti-Garcia, E.; Qiao, R.; Rao, J. N.; Ruina, A.; Shangguan, Z.; Shen, W. H.; Shen, Z. Q.; Shen, Z. T.; Silveri, L.; Song, J. X.; Stolpovskiy, M.; Su, H.; Su, M.; Sun, H. R.; Sun, Z. Y.; Surdo, A.; Teng, X. J.; Tykhonov, A.; Wang, J. Z.; Wang, L. G.; Wang, S.; Wang, S. X.; Wang, X. L.; Wang, Y.; Wang, Y. F.; Wang, Y. Z.; Wang, Z. M.; Wei, D. M.; Wei, J. J.; Wei, Y. F.; Wu, D.; Wu, J.; Wu, L. B.; Wu, S. S.; Wu, X.; Xia, Z. Q.; Xu, H. T.; Xu, J.; Xu, Z. H.; Xu, Z. L.; Xu, E. H.; Xu, Z. Z.; Xue, G. F.; Yang, H. B.; Yang, P.; Yang, Y. Q.; Yao, H. J.; Yu, Y. H.; Yuan, G. W.; Yuan, Q.; Yue, C.; Zang, J. J.; Zhang, S. X.; Zhang, W. Z.; Zhang, Yan; Zhang, Yi; Zhang, Y. J.; Zhang, Y. L.; Zhang, Y. P.; Zhang, Y. Q.; Zhang, Z.; Zhang, Z. Y.; Zhao, C.; Zhao, H. Y.; Zhao, X. F.; Zhou, C. Y.; Zhu, Y.

Chen W; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Yu N; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Gong H; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Li M; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Xu W; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Zhuo Z; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Sun Z; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Ni M; The Institute of Flexible Electronics, (IFE Future Technologies), Xiamen University(XMU), 422 Siming South Road, Xiamen, Fujian, 361005, China.; Huang W; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Yang J; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Lin Y; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Wang L; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Li H; State Key Laboratory of Organic Electronics and Information Displays & Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing, 210023, China.; Liang X; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Sun N; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Sun L; School of Flexible Electronics (SoFE) & State Key Laboratory of Optoelectronic Materials and Technologies, Sun Yat-sen University, 66 Gongchang Road, Shenzhen, 518107, China.; Bai L; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Han Y; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Tao Y; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Xu M; State Key Laboratory of Organic Electronics and Information Displays & Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing, 210023, China.; Yin C; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; An X; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Lin J; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; Huang W; Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing, 211816, China.; State Key Laboratory of Organic Electronics and Information Displays & Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing, 210023, China.; School of Flexible Electronics (SoFE) & State Key Laboratory of Optoelectronic Materials and Technologies, Sun Yat-sen University, 66 Gongchang Road, Shenzhen, 518107, China.

Publisher: Wiley-VCH Country of Publication: Germany NLM ID: 9885358 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1521-4095 (Electronic) Linking ISSN: 09359648 NLM ISO Abbreviation: Adv Mater Subsets: PubMed not MEDLINE; MEDLINE

Wang, M. X.; Gong, G. H.; Miao, P.; Sun, Z. Y.; Tang, J. N.; Wu, W. H.; Xu, D. L.

Sun Z; Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), Shandong University, 17923 Jingshi Road, Jinan 250061, China.; Guo Z; Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), Shandong University, 17923 Jingshi Road, Jinan 250061, China.; Tian S; Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), Shandong University, 17923 Jingshi Road, Jinan 250061, China.; Bi J; Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), Shandong University, 17923 Jingshi Road, Jinan 250061, China.; Li G; Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), Shandong University, 17923 Jingshi Road, Jinan 250061, China.; Sha Y; Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), Shandong University, 17923 Jingshi Road, Jinan 250061, China.; Wang J; Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), Shandong University, 17923 Jingshi Road, Jinan 250061, China.; Zhao L; School of Physics, Shandong University, Jinan 250100, China.; Qian L; Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), Shandong University, 17923 Jingshi Road, Jinan 250061, China.

Publisher: American Chemical Society Country of Publication: United States NLM ID: 101313589 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1936-086X (Electronic) Linking ISSN: 19360851 NLM ISO Abbreviation: ACS Nano Subsets: MEDLINE

DAMPE Collaboration; Alemanno, F.; Altomare, C.; An, Q.; Azzarello, P.; Barbato, F. C. T.; Bernardini, P.; Bi, X. J.; Cai, M. S.; Casilli, E.; Catanzani, E.; Chang, J.; Chen, D. Y.; Chen, J. L.; Chen, Z. F.; Cui, M. Y.; Cui, T. S.; Cui, Y. X.; Dai, H. T.; De-Benedittis, A.; De Mitri, I.; de Palma, F.; Deliyergiyev, M.; Di Giovanni, A.; Di Santo, M.; Ding, Q.; Dong, T. K.; Dong, Z. X.; Donvito, G.; Droz, D.; Duan, J. L.; Duan, K. K.; D'Urso, D.; Fan, R. R.; Fan, Y. Z.; Fang, F.; Fang, K.; Feng, C. Q.; Feng, L.; Alonso, M. F.; Frieden, J. M.; Fusco, P.; Gao, M.; Gargano, F.; Gong, K.; Gong, Y. Z.; Guo, D. Y.; Guo, J. H.; Han, S. X.; Hu, Y. M.; Huang, G. S.; Huang, X. Y.; Huang, Y. Y.; Ionica, M.; Jiang, L. Y.; Jiang, W.; Kong, J.; Kotenko, A.; Kyratzis, D.; Lei, S. J.; Li, W. L.; Li, W. H.; Li, X.; Li, X. Q.; Liang, Y. M.; Liu, C. M.; Liu, H.; Liu, J.; Liu, S. B.; Liu, Y.; Loparco, F.; Luo, C. N.; Ma, M.; Ma, P. X.; Ma, T.; Ma, X. Y.; Marsella, G.; Mazziotta, M. N.; Mo, D.; Salinas, M. M.; Niu, X. Y.; Pan, X.; Parenti, A.; Peng, W. X.; Peng, X. Y.; Perrina, C.; Qiao, R.; Rao, J. N.; Ruina, A.; Shangguan, Z.; Shen, W. H.; Shen, Z. Q.; Shen, Z. T.; Silveri, L.; Song, J. X.; Stolpovskiy, M.; Su, H.; Su, M.; Sun, H. R.; Sun, Z. Y.; Surdo, A.; Teng, X. J.; Tykhonov, A.; Wang, J. Z.; Wang, L. G.; Wang, S.; Wang, S. X.; Wang, X. L.; Wang, Y.; Wang, Y. F.; Wang, Y. Z.; Wei, D. M.; Wei, J. J.; Wei, Y. F.; Wu, D.; Wu, J.; Wu, L. B.; Wu, S. S.; Wu, X.; Xia, Z. Q.; Xu, E. H.; Xu, H. T.; Xu, J.; Xu, Z. H.; Xu, Z. L.; Xu, Z. Z.; Xue, G. F.; Yang, H. B.; Yang, P.; Yang, Y. Q.; Yao, H. J.; Yu, Y. H.; Yuan, G. W.; Yuan, Q.; Yue, C.; Zang, J. J.; Zhang, S. X.; Zhang, W. Z.; Zhang, Yan; Zhang, Yi.; Zhang, Y. J.; Zhang, Y. L.; Zhang, Y. P.; Zhang, Y. Q.; Zhang, Z.; Zhang, Z. Y.; Zhao, C.; Zhao, H. Y.; Zhao, X. F.; Zhou, C. Y.; Zhu, Y.

Physical Review D 106.6 (2022): 063026

Ye, Z. P.; Hu, F.; Tian, W.; Chang, Q. C.; Chang, Y. L.; Cheng, Z. S.; Gao, J.; Ge, T.; Gong, G. H.; Guo, J.; Guo, X. X.; He, X. G.; Huang, J. T.; Jiang, K.; Jiang, P. K.; Jing, Y. P.; Li, H. L.; Li, J. L.; Li, L.; Li, W. L.; Li, Z.; Liao, N. Y.; Lin, Q.; Liu, F.; Liu, J. L.; Liu, X. H.; Miao, P.; Mo, C.; Morton-Blake, I.; Peng, T.; Sun, Z. Y.; Tang, J. N.; Tang, Z. B.; Tao, C. H.; Tian, X. L.; Wang, M. X.; Wang, Y.; Wei, H. D.; Wei, Z. Y.; Wu, W. H.; Xian, S. S.; Xiang, D.; Xu, D. L.; Xue, Q.; Yang, J. H.; Yang, J. M.; Yu, W. B.; Zeng, C.; Zhang, F. Y. D.; Zhang, T.; Zhang, X. T.; Zhang, Y. Y.; Zhi, W.; Zhong, Y. S.; Zhou, M.; Zhu, X. H.; Zhuang, G. J.