학술논문

발행년
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(예 : 2010-2015)
'학술논문' 에서 검색결과 2,450건 | 목록 1~10
Conference
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-7 Apr, 2024
Report
Aker, M.Batzler, D.Beglarian, A.Behrens, J.Beisenkötter, J.Biassoni, M.Bieringer, B.Biondi, Y.Block, F.Bobien, S.Böttcher, M.Bornschein, B.Bornschein, L.Caldwell, T. S.Carminati, M.Chatrabhuti, A.Chilingaryan, S.Daniel, B. A.Debowski, K.Descher, M.Barrero, D. DíazDoe, P. J.Dragoun, O.Drexlin, G.Edzards, F.Eitel, K.Ellinger, E.Engel, R.Enomoto, S.Felden, A.Fengler, C.Fiorini, C.Formaggio, J. A.Forstner, C.Fränkle, F. M.Gauda, K.Gavin, A. S.Gil, W.Glück, F.Grössle, R.Gumbsheimer, R.Hannen, V.Hasselmann, L.Haußmann, N.Helbing, K.Heyns, S.Hickford, S.Hiller, R.Hillesheimer, D.Hinz, D.Höhn, T.Huber, A.Jansen, A.Karl, C.Kellerer, J.Khosonthongkee, K.Köhler, C.Köllenberger, L.Kopmann, A.Kovač, N.Krause, H.La Cascio, L.Lasserre, T.Lauer, J.Le, T. L.Lebeda, O.Lehnert, B.Li, G.Lokhov, A.Machatschek, M.Mark, M.Marsteller, A.Martin, E. L.McMichael, K.Melzer, C.Mertens, S.Mohanty, S.Mostafa, J.Müller, K.Nava, A.Neumann, H.Niemes, S.Parno, D. S.Pavan, M.Pinsook, U.Poon, A. W. P.Poyato, J. M. L.Pozzi, S.Priester, F.Ráliš, J.Ramachandran, S.Robertson, R. G. H.Rodenbeck, C.Röllig, M.Sack, R.Saenz, A.Salomon, R.Schäfer, P.Schlösser, M.Schlösser, K.Schlüter, L.Schneidewind, S.Schrank, M.Schürmann, J.Schütz, A. K.Schwemmer, A.Schwenck, A.Šefčík, M.Siegmann, D.Simon, F.Spanier, F.Spreng, D.Sreethawong, W.Steidl, M.Štorek, J.Stribl, X.Sturm, M.Suwonjandee, N.Jerome, N. TanTelle, H. H.Thorne, L. A.Thümmler, T.Titov, N.Tkachev, I.Urban, K.Valerius, K.Vénos, D.Weinheimer, C.Welte, S.Wendel, J.Wiesinger, C.Wilkerson, J. F.Wolf, J.Wüstling, S.Wydra, J.Xu, W.Zadorozhny, S.Zeller, G.
Report
Aker, M.Batzler, D.Beglarian, A.Behrens, J.Beisenkötter, J.Biassoni, M.Bieringer, B.Biondi, Y.Block, F.Bobien, S.Böttcher, M.Bornschein, B.Bornschein, L.Caldwell, T. S.Carminati, M.Chatrabhuti, A.Chilingaryan, S.Daniel, B. A.Debowski, K.Descher, M.Barrero, D. DíazDoe, P. J.Dragoun, O.Drexlin, G.Edzards, F.Eitel, K.Ellinger, E.Engel, R.Enomoto, S.Felden, A.Fengler, C.Fiorini, C.Formaggio, J. A.Forstner, C.Fränkle, F. M.Gauda, K.Gavin, A. S.Gil, W.Glück, F.Grohmann, S.Grössle, R.Gumbsheimer, R.Gutknecht, N.Hannen, V.Hasselmann, L.Haußmann, N.Helbing, K.Henke, H.Heyns, S.Hickford, S.Hiller, R.Hillesheimer, D.Hinz, D.Höhn, T.Huber, A.Jansen, A.Karl, C.Kellerer, J.Khosonthongkee, K.Kleifges, M.Klein, M.Kohpeiß, J.Köhler, C.Köllenberger, L.Kopmann, A.Kovač, N.Kovalík, A.Krause, H.La Cascio, L.Lasserre, T.Lauer, J.Le, T.Lebeda, O.Lehnert, B.Li, G.Lokhov, A.Machatschek, M.Mark, M.Marsteller, A.Martin, E. L.Melzer, C.Mertens, S.Mohanty, S.Mostafa, J.Müller, K.Nava, A.Neumann, H.Niemes, S.Onillon, A.Parno, D. S.Pavan, M.Pinsook, U.Poon, A. W. P.Poyato, J. M. LopezPozzi, S.Priester, F.Ráliš, J.Ramachandran, S.Robertson, R. G. H.Rodenbeck, C.Röllig, M.Röttele, C.Ryšavý, M.Sack, R.Saenz, A.Salomon, R.Schäfer, P.Schlösser, M.Schlösser, K.Schlüter, L.Schneidewind, S.Schnurr, U.Schrank, M.Schürmann, J.Schütz, A.Schwemmer, A.Schwenck, A.Šefčík, M.Siegmann, D.Simon, F.Spanier, F.Spreng, D.Sreethawong, W.Steidl, M.Štorek, J.Stribl, X.Sturm, M.Suwonjandee, N.Jerome, N. TanTelle, H. H.Thorne, L. A.Thümmler, T.Tirolf, S.Titov, N.Tkachev, I.Urban, K.Valerius, K.Vénos, D.Weinheimer, C.Welte, S.Wendel, J.Wiesinger, C.Wilkerson, J. F.Wolf, J.Wüstling, S.Wydra, J.Xu, W.Zadorozhny, S.Zeller, G.
Conference
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-8 Apr, 2023
Report
Arenz, M.Baek, W. -J.Beck, M.Beglarian, A.Behrens, J.Bergmann, T.Berlev, A.Besserer, U.Blaum, K.Bode, T.Bornschein, B.Bornschein, L.Brunst, T.Buzinsky, N.Chilingaryan, S.Choi, W. Q.Deffert, M.Doe, P. J.Dragoun, O.Drexlin, G.Dyba, S.Edzards, F.Eitel, K.Ellinger, E.Engel, R.Enomoto, S.Erhard, M.Eversheim, D.Fedkevych, M.Fischer, S.Formaggio, J. A.Fränkle, F. M.Franklin, G. B.Friedel, F.Fulst, A.Gil, W.Glück, F.Ureña, A. GonzalezGrohmann, S.Grössle, R.Gumbsheimer, R.Hackenjos, M.Hannen, V.Harms, F.Haußmann, N.Heizmann, F.Helbing, K.Herz, W.Hickford, S.Hilk, D.Hillesheimer, D.Howe, M. A.Huber, A.Jansen, A.Kellerer, J.Kernert, N.Kippenbrock, L.Kleesiek, M.Klein, M.Kopmann, A.Korzeczek, M.Kovalík, A.Krasch, B.Kraus, M.Kuckert, L.Lasserre, T.Lebeda, O.Letnev, J.Lokhov, A.Machatschek, M.Marsteller, A.Martin, E. L.Mertens, S.Mirz, S.Monreal, B.Neumann, H.Niemes, S.Off, A.Osipowicz, A.Otten, E.Parno, D. S.Pollithy, A.Poon, A. W. P.Priester, F.Ranitzsch, P. C. -O.Rest, O.Robertson, R. G. H.Roccati, F.Rodenbeck, C.Röllig, M.Röttele, C.Ryšavý, M.Sack, R.Saenz, A.Schimpf, L.Schlösser, K.Schlösser, M.Schönung, K.Schrank, M.Seitz-Moskaliuk, H.Sentkerestiová, J.Sibille, V.Slezák, M.Steidl, M.Steinbrink, N.Sturm, M.Suchopar, M.Suesser, M.Telle, H. H.Thorne, L. A.Thümmler, T.Titov, N.Tkachev, I.Trost, N.Valerius, K.Vénos, D.Vianden, R.Hernández, A. P. VizcayaWeber, M.Weinheimer, C.Weiss, C.Welte, S.Wendel, J.Wilkerson, J. F.Wolf, J.Wüstling, S.Zadoroghny, S.
Eur. Phys. J. C (2018) 78:368
Conference
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-10 Apr, 2022
Conference
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-6 Apr, 2022
Conference
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-8 Apr, 2022
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[검색어] Roellig, M.
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