학술논문
'학술논문'
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Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(8):1096-1103 Aug, 2023
Conference
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-4 Sep, 2022
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[검색어] Leveque, A.
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