부산대학교 도서관

Chen, H.; Liu, Y.; Kumarasubramanian, H.; Surendran, M.; Ravichandran, J.

In: ACS Applied Electronic Materials. (ACS Applied Electronic Materials, 26 November 2024, 6(11):8143-8149)

Yu, R.; Ravichandran, J.; Povinelli, M.L.; Shrewsbury, B.K.; Wu, C.; Kumarasubramanian, H.; Surendran, M.

In: Applied Physics Letters. (Applied Physics Letters, 16 September 2024, 125(12))

Surendran, M.; Kumarasubramanian, H.; Ravichandran, J.; Rollag, J.R.; Stevens, C.E.; Gibson, R.; Hendrickson, J.R.; Fu, C.-T.; Wang, Z.; Schlom, D.G.

In: ACS Applied Electronic Materials. (ACS Applied Electronic Materials, 28 May 2024, 6(5):3539-3544)

Tasneem N; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Kashyap H; Department of Chemistry and BioChemistry, University of California, San Diego, La Jolla, California 92093, United States.; Chae K; Department of Chemistry and BioChemistry, University of California, San Diego, La Jolla, California 92093, United States.; Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United States.; Park C; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Lee PC; Department of Chemistry and BioChemistry, University of California, San Diego, La Jolla, California 92093, United States.; Lombardo SF; School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Afroze N; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Tian M; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Kumarasubramanian H; Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, California 90089, United States.; Hur J; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Chen H; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Chern W; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Yu S; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Bandaru P; Department of Materials Science and Engineering, University of California, San Diego, La Jolla, California 92093, United States.; Ravichandran J; Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, California 90089, United States.; Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, Los Angeles 90089, United States.; Cho K; Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United States.; Kacher J; School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Kummel AC; Department of Chemistry and BioChemistry, University of California, San Diego, La Jolla, California 92093, United States.; Khan AI; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.

Publisher: American Chemical Society Country of Publication: United States NLM ID: 101504991 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1944-8252 (Electronic) Linking ISSN: 19448244 NLM ISO Abbreviation: ACS Appl Mater Interfaces Subsets: MEDLINE; PubMed not MEDLINE

Chae K; Department of Chemistry and Biochemistry, University of California, San Diego, La Jolla, California 92093, United States.; Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United States.; Lombardo SF; School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Tasneem N; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Tian M; Institute of Electronics and Nanotechnology, Georgia Institute of Technology, Atlanta, Georgia 30318, United States.; Kumarasubramanian H; Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, California 90089, United States.; Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, California 90089, United States.; Hur J; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Chern W; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, Massachusetts 02142, United States.; Yu S; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Richter C; NaMLab gGmbH/TU Dresden, Noethnitzer Str. 64 a, Dresden D-01187, Germany.; Lomenzo PD; NaMLab gGmbH/TU Dresden, Noethnitzer Str. 64 a, Dresden D-01187, Germany.; Hoffmann M; NaMLab gGmbH/TU Dresden, Noethnitzer Str. 64 a, Dresden D-01187, Germany.; Schroeder U; NaMLab gGmbH/TU Dresden, Noethnitzer Str. 64 a, Dresden D-01187, Germany.; Triyoso D; TEL Technology Center, America, LLC, Albany, New York 12203, United States.; Consiglio S; TEL Technology Center, America, LLC, Albany, New York 12203, United States.; Tapily K; TEL Technology Center, America, LLC, Albany, New York 12203, United States.; Clark R; TEL Technology Center, America, LLC, Albany, New York 12203, United States.; Leusink G; TEL Technology Center, America, LLC, Albany, New York 12203, United States.; Bassiri-Gharb N; G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Bandaru P; Department of Mechanical & Aerospace Engineering, University of California, La Jolla, San Diego, California 92093, United States.; Ravichandran J; Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, California 90089, United States.; Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, California 90089, United States.; Kummel A; Department of Chemistry and Biochemistry, University of California, San Diego, La Jolla, California 92093, United States.; Cho K; Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United States.; Kacher J; School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; Khan AI; School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.

Publisher: American Chemical Society Country of Publication: United States NLM ID: 101504991 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1944-8252 (Electronic) Linking ISSN: 19448244 NLM ISO Abbreviation: ACS Appl Mater Interfaces Subsets: MEDLINE; PubMed not MEDLINE

Orvis T; Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, 925 Bloom Walk, Los Angeles, California 90089, United States.; Core Center for Excellence in Nano Imaging, University of Southern California, 925 Bloom Walk, Los Angeles, California 90089, United States.; Cao T; Department of Mechanical Engineering & Materials Science, and Institute of Materials Science & Engineering, Washington University in St. Louis, One Brookings Drive, St. Louis, Missouri 63130, United States.; Surendran M; Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, 925 Bloom Walk, Los Angeles, California 90089, United States.; Core Center for Excellence in Nano Imaging, University of Southern California, 925 Bloom Walk, Los Angeles, California 90089, United States.; Kumarasubramanian H; Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, 925 Bloom Walk, Los Angeles, California 90089, United States.; Thind AS; Department of Mechanical Engineering & Materials Science, and Institute of Materials Science & Engineering, Washington University in St. Louis, One Brookings Drive, St. Louis, Missouri 63130, United States.; Cunniff A; Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, 925 Bloom Walk, Los Angeles, California 90089, United States.; Mishra R; Department of Mechanical Engineering & Materials Science, and Institute of Materials Science & Engineering, Washington University in St. Louis, One Brookings Drive, St. Louis, Missouri 63130, United States.; Ravichandran J; Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, 925 Bloom Walk, Los Angeles, California 90089, United States.; Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, 925 Bloom Walk, Los Angeles, California 90089, United States.

Publisher: American Chemical Society Country of Publication: United States NLM ID: 101088070 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1530-6992 (Electronic) Linking ISSN: 15306984 NLM ISO Abbreviation: Nano Lett Subsets: MEDLINE; PubMed not MEDLINE

Orvis, T.; Kumarasubramanian, H.; Surendran, M.; Kutagulla, S.; Cunniff, A.; Ravichandran, J.

In: ACS Applied Electronic Materials. (ACS Applied Electronic Materials, 23 March 2021, 3(3):1422-1428)

Ngo, A.; Jagadish, K.; Kumarasubramanian, H.; Ravichandran, J.; Shao, Y.-T.; Avishai, A.; Chae, H.U.; Kapadia, R.; Ramesh, M.; Schlom, D.G.

In: Microscopy and Microanalysis, 2024 Proceedings - Microscopy and Microanalysis, M and M 2024. (Microscopy and Microanalysis, 24 July 2024, 30(2024):708-709)

Yu, R.; Povinelli, M.L.; Shrewsbury, B.K.; Wu, C.; Kumarasubramanian, H.; Surendran, M.; Ravichandran, J.

In: Proceedings of SPIE - The International Society for Optical Engineering, Photosensitive Materials and their Applications III. (Proceedings of SPIE - The International Society for Optical Engineering, 2024, 13015)

R. C. Chakinala; A. Kumarasubramanian; R. Manokaran; G. Noubir; C. Pandu Rangan; R. Sundaram

Lecture Notes in Computer Science ISBN: 9783540741237