부산대학교 도서관

Muscogiuri, G; Salmon, Ab; Aguayo Mazzucato, C; Li, M; Balas, B; Guardado Mendoza, R; Giaccari, Andrea; Reddick, Rl; Reyna, Sm; Weir, G; Defronzo, Ra; Van Remmen, H; Musi, N.

Diabetes

Caputo A; Tomai M; Lai C; Desideri A; Pomoni E; Méndez HC; Castellanos BA; La Longa F; Crescimbene M; Cardoza Hernández CC; Gómez Mejía KE; González Nolasco TK; Flores JL; Flores López LE; López Villalta JJ; Martínez de Guzmán YB; Flores Martínez YI; Martínez Sánchez EV; Mayorga de Ramos F; Mejía de Guardado AC; del Carmen Merino de Lozan M; Monge Tobar JS; Monserratt Jiménez de Henríquez C; Moreno LS; Peña Saravia KA; Pineda de Ortega IC; Santos Gamero GM; Siciliano de Serpas SM; Juarez Contreras TS; Ventura de Ramos MR; Gómez Menéndez WY; Valle Bravo LY; Langher V

Int J Environ Res Public Health
International journal of environmental research and public health (Online) 19 (2022). doi:10.3390/ijerph19031109
info:cnr-pdr/source/autori:Caputo A.[1], Tomai M.[1], Lai C.[1], Desideri A.[1], Pomoni E.[2], Méndez H.C.[3], Castellanos B.A.[3], La Longa F.[4], Crescimbene M.[4], Cardoza Hernández C.C.[3], Gómez Mejía K.E.[3], González Nolasco T.K.[3], Flores J.L.[3], Flores López L.E.[3], López Villalta J.J.[3], Martínez de Guzmán Y.B.[3], Flores Martínez Y.I.[3], Martínez Sánchez E.V.[3], Mayorga de Ramos F.[3], Mejía de Guardado A.C. [3], del Carmen Merino de Lozan M.[3], Monge Tobar J.S.[3], Monserratt Jiménez de Henríquez C.[3], Moreno L.S. [3], Peña Saravia K.A.[3], Pineda de Ortega I.C.[3], Santos Gamero G.M.[3], Siciliano de Serpas S.M.[3], Juarez Contreras T.S.[3], Ventura de Ramos M.R.[3], Gómez Menéndez W.Y.[3], Valle Bravo L.Y.[3], Langher V.[1]/titolo:The Perception of Water Contamination and Risky Consumption in El Salvador from a Community Clinical Psychology Perspective/doi:10.3390%2Fijerph19031109/rivista:International journal of environmental research and public health (Online)/anno:2022/pagina_da:/pagina_a:/intervallo_pagine:/volume:19
International Journal of Environmental Research and Public Health; Volume 19; Issue 3; Pages: 1109

José Luis Monroy‐Morales; Rafael Peña‐Alzola; Rafael Sebastián‐Fernández; David Campos‐Gaona; Jerónimo Quesada Castellano; José L. Guardado

IET Renewable Power Generation, Vol 18, Iss 6, Pp 1040-1054 (2024)

López-Mora DJ; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Normalistas No. 800, Colinas de la Normal, Guadalajara C.P. 44270, Jalisco, Mexico.; Flores-Dávalos AG; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Normalistas No. 800, Colinas de la Normal, Guadalajara C.P. 44270, Jalisco, Mexico.; Lorenzo-Santiago MA; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Normalistas No. 800, Colinas de la Normal, Guadalajara C.P. 44270, Jalisco, Mexico.; Guardado-Fierros BG; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Normalistas No. 800, Colinas de la Normal, Guadalajara C.P. 44270, Jalisco, Mexico.; Rodriguez-Campos J; Unidad de Servicios Analíticos y Metrológicos, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Guadalajara C.P. 44270, Jalisco, Mexico.; Contreras-Ramos SM; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Normalistas No. 800, Colinas de la Normal, Guadalajara C.P. 44270, Jalisco, Mexico.

Publisher: MDPI AG Country of Publication: Switzerland NLM ID: 101625893 Publication Model: Electronic Cited Medium: Print ISSN: 2076-2607 (Print) Linking ISSN: 20762607 NLM ISO Abbreviation: Microorganisms Subsets: PubMed not MEDLINE

Guardado-Fierros BG; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Guadalajara, Jalisco, México.; Lorenzo-Santiago MA; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Guadalajara, Jalisco, México.; Kirchmayr MR; Unidad de Biotecnología Industrial, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Zapopan, Jalisco, México.; Patrón-Soberano OA; División de Biología Molecular, Instituto Potosino de Investigación Científica y Tecnológica A.C. (IPICYT), Camino a la Presa San José 2055, Lomas 4ª. Sección, San Luis Potosí, San Luis Potosí, 78216, México.; Rodriguez-Campos J; Unidad de Servicios Analíticos y Metrológicos, CIATEJ, Guadalajara, Jalisco, México. jarodriguez@ciatej.mx.; Contreras-Ramos SM; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Guadalajara, Jalisco, México. smcontreras@ciatej.mx.

Publisher: Springer Country of Publication: Germany NLM ID: 9012472 Publication Model: Electronic Cited Medium: Internet ISSN: 1573-0972 (Electronic) Linking ISSN: 09593993 NLM ISO Abbreviation: World J Microbiol Biotechnol Subsets: MEDLINE

María Ballén-Torres, Angélica; Lola Evia-Viscarra, María; Guardado-Mendoza, Rodolfo; Beatriz Muñoz-López, Daniela; Efrén Lozada-Hernández, Edgar; Fernando Meneses-Rojas, Luis

Nutrición Hospitalaria. sep/oct2024, Vol. 41 Issue 5, p1105-1115. 11p.

Engdahl TB; Department of Pathology, Microbiology and Immunology, Vanderbilt University, Nashville, United States.; Binshtein E; Vanderbilt Vaccine Center, Vanderbilt University Medical Center, Nashville, United States.; Brocato RL; Virology Division, United States Army Medical Research Institute of Infectious Diseases, Ft Detrick, United States.; Kuzmina NA; Department of Pathology, The University of Texas Medical Branch at Galveston, Galveston, United States.; Galveston National Laboratory, Galveston, United States.; Principe LM; Virology Division, United States Army Medical Research Institute of Infectious Diseases, Ft Detrick, United States.; Kwilas SA; Virology Division, United States Army Medical Research Institute of Infectious Diseases, Ft Detrick, United States.; Kim RK; Virology Division, United States Army Medical Research Institute of Infectious Diseases, Ft Detrick, United States.; Chapman NS; Department of Pathology, Microbiology and Immunology, Vanderbilt University, Nashville, United States.; Porter MS; Department of Pathology, Microbiology and Immunology, Vanderbilt University, Nashville, United States.; Guardado-Calvo P; Institut Pasteur, Université Paris Cité, Paris, France.; Rey FA; Institut Pasteur, Université Paris Cité, Paris, France.; Handal LS; Vanderbilt Vaccine Center, Vanderbilt University Medical Center, Nashville, United States.; Diaz SM; Vanderbilt Vaccine Center, Vanderbilt University Medical Center, Nashville, United States.; Zagol-Ikapitte IA; Department of Biochemistry and Mass Spectrometry Research Center, Vanderbilt University, Nashville, United States.; Tran MH; Department of Biochemistry and Mass Spectrometry Research Center, Vanderbilt University, Nashville, United States.; McDonald WH; Department of Biochemistry and Mass Spectrometry Research Center, Vanderbilt University, Nashville, United States.; Meiler J; Department of Chemistry, Vanderbilt University, Nashville, United States.; Reidy JX; Vanderbilt Vaccine Center, Vanderbilt University Medical Center, Nashville, United States.; Trivette A; Vanderbilt Vaccine Center, Vanderbilt University Medical Center, Nashville, United States.; Bukreyev A; Department of Pathology, The University of Texas Medical Branch at Galveston, Galveston, United States.; Galveston National Laboratory, Galveston, United States.; Department of Microbiology and Immunology, University of Texas Medical Branch, Galveston, United States.; Hooper JW; Virology Division, United States Army Medical Research Institute of Infectious Diseases, Ft Detrick, United States.; Crowe JE; Department of Pathology, Microbiology and Immunology, Vanderbilt University, Nashville, United States.; Vanderbilt Vaccine Center, Vanderbilt University Medical Center, Nashville, United States.; Department of Pediatrics, Vanderbilt University Medical Center, Nashville, United States.

Publisher: eLife Sciences Publications, Ltd Country of Publication: England NLM ID: 101579614 Publication Model: Electronic Cited Medium: Internet ISSN: 2050-084X (Electronic) Linking ISSN: 2050084X NLM ISO Abbreviation: Elife Subsets: MEDLINE

Guardado-Fierros BG; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Guadalajara, Jalisco, Mexico.; Tuesta-Popolizio DA; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Guadalajara, Jalisco, Mexico.; Lorenzo-Santiago MA; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Guadalajara, Jalisco, Mexico.; Rodriguez-Campos J; Unidad de Servicios Analíticos y Metrológicos, CIATEJ, Guadalajara, Jalisco, Mexico.; Contreras-Ramos SM; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Guadalajara, Jalisco, Mexico.

Publisher: Frontiers Research Foundation Country of Publication: Switzerland NLM ID: 101568200 Publication Model: eCollection Cited Medium: Print ISSN: 1664-462X (Print) Linking ISSN: 1664462X NLM ISO Abbreviation: Front Plant Sci Subsets: PubMed not MEDLINE

Kim JH; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.; Vázquez-Guardado A; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.; Department of Electrical and Computer Engineering, North Carolina State University, Raleigh, NC 27606.; Luan H; Department of Mechanical and Aerospace Engineering, University of California San Diego, La Jolla, CA 92093.; Kim JT; Department of Mechanical Engineering, Pohang University of Science and Technology, Pohang 37673, Republic of Korea.; Yang DS; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.; Zhang H; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208.; Chang JK; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.; Wearifi Inc., Evanston, IL 60208.; Yoo S; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.; Park C; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.; Wei Y; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208.; Christiansen Z; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.; Kim S; School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, Republic of Korea.; Avila R; Department of Mechanical Engineering, Rice University, Houston, TX 77005.; Kim JU; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.; Lee YJ; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.; Shin HS; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.; Zhou M; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.; Jeon SW; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.; Baek JM; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL 61801.; Lee Y; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL 61801.; Kim SY; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL 61801.; Lim J; Department of Electronic Engineering, Hanyang University, Seoul 04763, Republic of Korea.; Park M; Department of Polymer Science and Engineering, Dankook University, Yongin 16890, Republic of Korea.; Jeong H; Department of Electrical and Computer Engineering, University of California, Davis, CA 95616.; Won SM; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea.; Chen R; Department of Mechanical and Aerospace Engineering, University of California San Diego, La Jolla, CA 92093.; Huang Y; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208.; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208.; Jung YH; Department of Electronic Engineering, Hanyang University, Seoul 04763, Republic of Korea.; Yoo JY; Department of Semiconductor Convergence Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea.; Rogers JA; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208.; Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208.; Department of Neurological Surgery, Northwestern University, Chicago, IL 60208.

Publisher: National Academy of Sciences Country of Publication: United States NLM ID: 7505876 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1091-6490 (Electronic) Linking ISSN: 00278424 NLM ISO Abbreviation: Proc Natl Acad Sci U S A Subsets: MEDLINE

Guardado-Fierros BG; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Normalistas No. 800, Colinas de la Normal, Guadalajara 44270, Jalisco, Mexico.; Tuesta-Popolizio DA; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Normalistas No. 800, Colinas de la Normal, Guadalajara 44270, Jalisco, Mexico.; Lorenzo-Santiago MA; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Normalistas No. 800, Colinas de la Normal, Guadalajara 44270, Jalisco, Mexico.; Rubio-Cortés R; Promoción y Fomento de Agave S. de R.L. de C.V., Ignacio Zaragosa #55 C.P., Ixtlahuacán del Río 45260, Jalisco, Mexico.; Camacho-Ruíz RM; Unidad de Biotecnología Industrial, CIATEJ, Camino Arenero 127, Zapopan 44270, Jalisco, Mexico.; Castañeda-Nava JJ; Unidad de Biotecnología Vegetal, CIATEJ, Camino Arenero 127, Zapopan 44270, Jalisco, Mexico.; Gutiérrez-Mora A; Unidad de Biotecnología Vegetal, CIATEJ, Camino Arenero 127, Zapopan 44270, Jalisco, Mexico.; Contreras-Ramos SM; Unidad de Tecnología Ambiental, Centro de Investigación y Asistencia en Tecnología y Diseño del Estado de Jalisco A.C. (CIATEJ), Normalistas No. 800, Colinas de la Normal, Guadalajara 44270, Jalisco, Mexico.

Publisher: MDPI AG Country of Publication: Switzerland NLM ID: 101596181 Publication Model: Electronic Cited Medium: Print ISSN: 2223-7747 (Print) Linking ISSN: 22237747 NLM ISO Abbreviation: Plants (Basel) Subsets: PubMed not MEDLINE

Oh YS; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Kim JH; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Xie Z; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China.; Cho S; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Han H; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Jeon SW; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.; Park M; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Namkoong M; Department of Biomedical Engineering, Texas A&M University, College Station, TX, USA.; Avila R; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.; Song Z; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China.; Lee SU; Advanced 3D Printing Technology Development Division, Korea Atomic Energy Research Institute, Daejeon, Republic of Korea.; Ko K; Qualcomm Institute, La Jolla, CA, USA.; Lee J; Sibel Health Inc, Niles, IL, USA.; Lee JS; Department of Rehabilitation Medicine, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea.; Min WG; Department of Planning and Development, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea.; Lee BJ; Department of Rehabilitation Medicine, Pusan national university hospital, Busan, Republic of Korea.; Choi M; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Chung HU; Sibel Health Inc, Niles, IL, USA.; Kim J; Sibel Health Inc, Niles, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Kyung Hee University, Yongin, Republic of Korea.; Han M; Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, People's Republic of China.; Koo J; School of Biomedical Engineering, Korea University, Seoul, Republic of Korea.; Interdisciplinary Program in Precision Public Health, Korea University, Seoul, Republic of Korea.; Choi YS; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Kwak SS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Kim SB; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Kim J; Department of Electronic Convergence Engineering, Kwangwoon University, Seoul, Republic of Korea.; Choi J; School of Mechanical Engineering, Kookmin University, Seoul, Republic of Korea.; Kang CM; Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA.; Kim JU; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; School of Chemical Engineering, Sungkyunkwan University, Suwon, Republic of Korea.; Kwon K; School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Won SM; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea.; Baek JM; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Lee Y; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Kim SY; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Lu W; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Vazquez-Guardado A; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Jeong H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Ryu H; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Lee G; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Kim K; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Kim S; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Kim MS; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Choi J; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Choi DY; Biomedical Manufacturing Technology Center, Korea Institute of Industrial Technology (KITECH), Yeongcheon, Republic of Korea.; Yang Q; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Zhao H; Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA, USA.; Bai W; Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, USA.; Jang H; Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI, USA.; Yu Y; NeuroLux, Inc, Glenview, IL, USA.; Lim J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Guo X; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China.; Kim BH; Department of Organic Materials and Fiber Engineering, Soongsil University, Seoul, Republic of Korea.; Jeon S; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Davies C; Carle Neuroscience Institute, Carle, Physician Group, Urbana, IL, USA.; Banks A; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Sung HJ; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Huang Y; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Departments of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Park I; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea. inkyu@kaist.ac.kr.; Rogers JA; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea. jrogers@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, USA. jrogers@northwestern.edu.

Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: PubMed not MEDLINE; MEDLINE

Oh YS; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Kim JH; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Xie Z; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China.; Cho S; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Han H; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Jeon SW; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.; Park M; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Namkoong M; Department of Biomedical Engineering, Texas A&M University, College Station, TX, USA.; Avila R; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.; Song Z; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China.; Lee SU; Advanced 3D Printing Technology Development Division, Korea Atomic Energy Research Institute, Daejeon, Republic of Korea.; Ko K; Qualcomm Institute, La Jolla, CA, USA.; Lee J; Sibel Health Inc, Niles, IL, USA.; Lee JS; Department of Rehabilitation Medicine, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea.; Min WG; Department of Planning and Development, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea.; Lee BJ; Department of Rehabilitation Medicine, Pusan national university hospital, Busan, Republic of Korea.; Choi M; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Chung HU; Sibel Health Inc, Niles, IL, USA.; Kim J; Sibel Health Inc, Niles, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Kyung Hee University, Yongin, Republic of Korea.; Han M; Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, People's Republic of China.; Koo J; School of Biomedical Engineering, Korea University, Seoul, Republic of Korea.; Interdisciplinary Program in Precision Public Health, Korea University, Seoul, Republic of Korea.; Choi YS; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Kwak SS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Kim SB; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Kim J; Department of Electronic Convergence Engineering, Kwangwoon University, Seoul, Republic of Korea.; Choi J; School of Mechanical Engineering, Kookmin University, Seoul, Republic of Korea.; Kang CM; Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA.; Kim JU; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; School of Chemical Engineering, Sungkyunkwan University, Suwon, Republic of Korea.; Kwon K; School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Won SM; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea.; Baek JM; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Lee Y; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Kim SY; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Lu W; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Vazquez-Guardado A; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Jeong H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Ryu H; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Lee G; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Kim K; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Kim S; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Kim MS; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Choi J; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Choi DY; Biomedical Manufacturing Technology Center, Korea Institute of Industrial Technology (KITECH), Yeongcheon, Republic of Korea.; Yang Q; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Zhao H; Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA, USA.; Bai W; Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, USA.; Jang H; Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI, USA.; Yu Y; NeuroLux, Inc, Glenview, IL, USA.; Lim J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Guo X; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China.; Kim BH; Department of Organic Materials and Fiber Engineering, Soongsil University, Seoul, Republic of Korea.; Jeon S; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Davies C; Carle Neuroscience Institute, Carle, Physician Group, Urbana, IL, USA.; Banks A; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Sung HJ; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.; Huang Y; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Departments of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Park I; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea. inkyu@kaist.ac.kr.; Rogers JA; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea. jrogers@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, USA. jrogers@northwestern.edu.

Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: MEDLINE

Choi YS; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.; Hsueh YY; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Division of Plastic and Reconstructive Surgery, Department of Surgery, National Cheng Kung University Hospital, College of Medicine, National Cheng Kung University, Tainan, 70456, Taiwan.; International Research Center for Wound Repair and Regeneration, National Cheng Kung University, Tainan, 70456, Taiwan.; Koo J; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; School of Biomedical Engineering, Korea University, Seoul, 02841, Republic of Korea.; Interdisciplinary Program in Precision Public Health, Korea University, Seoul, 02841, Republic of Korea.; Yang Q; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Avila R; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Hu B; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Department of Medicine, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Xie Z; State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian, University of Technology, 116024, Dalian, China.; Department of Engineering Mechanics, Dalian University of Technology, 116024, Dalian, China.; International Research Center for Computational Mechanics, Dalian University of Technology, 116024, Dalian, China.; Lee G; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Ning Z; State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, 310027, Hangzhou, China.; Liu C; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Xu Y; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.; Lee YJ; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Zhao W; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Department of Medicine, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Fang J; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Department of Medicine, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Deng Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.; State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, 200240, Shanghai, China.; Lee SM; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Vázquez-Guardado A; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.; Stepien I; Center for Developmental Therapeutics, Chemistry Life Processes Institute, Northwestern University, Evanston, IL, 60208, USA.; Yan Y; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO, 63110, USA.; Song JW; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Haney C; Center for Advanced Molecular Imaging, Northwestern University, Evanston, IL, 60208, USA.; Oh YS; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Liu W; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Yoon HJ; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea.; Banks A; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; MacEwan MR; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO, 63110, USA.; Ameer GA; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Center for Advanced Regenerative Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA.; Ray WZ; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO, 63110, USA.; Huang Y; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, 60208, USA.; Xie T; State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, 310027, Hangzhou, China.; Franz CK; Regenerative Neurorehabilitation Laboratory, Biologics, Shirley Ryan AbilityLab, Chicago, IL, 60611, USA.; Department of Physical Medicine and Rehabilitation, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA.; The Ken & Ruth Davee Department of Neurology, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA.; Li S; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA. songli@ucla.edu.; Department of Medicine, University of California, Los Angeles, Los Angeles, CA, 90095, USA. songli@ucla.edu.; Rogers JA; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA. jrogers@northwestern.edu.

Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: PubMed not MEDLINE; MEDLINE

Choi YS; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.; Hsueh YY; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Division of Plastic and Reconstructive Surgery, Department of Surgery, National Cheng Kung University Hospital, College of Medicine, National Cheng Kung University, Tainan, 70456, Taiwan.; International Research Center for Wound Repair and Regeneration, National Cheng Kung University, Tainan, 70456, Taiwan.; Koo J; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; School of Biomedical Engineering, Korea University, Seoul, 02841, Republic of Korea.; Interdisciplinary Program in Precision Public Health, Korea University, Seoul, 02841, Republic of Korea.; Yang Q; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Avila R; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Hu B; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Department of Medicine, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Xie Z; State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian, University of Technology, 116024, Dalian, China.; Department of Engineering Mechanics, Dalian University of Technology, 116024, Dalian, China.; International Research Center for Computational Mechanics, Dalian University of Technology, 116024, Dalian, China.; Lee G; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Ning Z; State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, 310027, Hangzhou, China.; Liu C; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Xu Y; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.; Lee YJ; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Zhao W; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Department of Medicine, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Fang J; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Department of Medicine, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Deng Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.; State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, 200240, Shanghai, China.; Lee SM; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Vázquez-Guardado A; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.; Stepien I; Center for Developmental Therapeutics, Chemistry Life Processes Institute, Northwestern University, Evanston, IL, 60208, USA.; Yan Y; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO, 63110, USA.; Song JW; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Haney C; Center for Advanced Molecular Imaging, Northwestern University, Evanston, IL, 60208, USA.; Oh YS; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; Liu W; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA.; Yoon HJ; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea.; Banks A; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA.; MacEwan MR; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO, 63110, USA.; Ameer GA; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Center for Advanced Regenerative Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA.; Ray WZ; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO, 63110, USA.; Huang Y; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, 60208, USA.; Xie T; State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, 310027, Hangzhou, China.; Franz CK; Regenerative Neurorehabilitation Laboratory, Biologics, Shirley Ryan AbilityLab, Chicago, IL, 60611, USA.; Department of Physical Medicine and Rehabilitation, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA.; The Ken & Ruth Davee Department of Neurology, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA.; Li S; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA. songli@ucla.edu.; Department of Medicine, University of California, Los Angeles, Los Angeles, CA, 90095, USA. songli@ucla.edu.; Rogers JA; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Querrey Simpson Institute for Biotechnology, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA. jrogers@northwestern.edu.

Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: MEDLINE

Guardado-Calvo P; Institut Pasteur, Département de Virologie, Unité de Virologie Structurale, 75724 Paris Cedex 15, France. pablo.guardado-calvo@pasteur.fr jhub@gwdg.de felix.rey@pasteur.fr.; UMR 3569 Virologie, CNRS-Institut Pasteur, 25-28 Rue du Docteur Roux, 75015 Paris, France.; Atkovska K; Institute for Microbiology and Genetics, University of Goettingen, Justus-von-Liebig weg 11, 37077 Göttingen, Germany.; Jeffers SA; Institut Pasteur, Département de Virologie, Unité de Virologie Structurale, 75724 Paris Cedex 15, France.; UMR 3569 Virologie, CNRS-Institut Pasteur, 25-28 Rue du Docteur Roux, 75015 Paris, France.; Grau N; Institut Pasteur, Département de Virologie, Unité de Virologie Structurale, 75724 Paris Cedex 15, France.; UMR 3569 Virologie, CNRS-Institut Pasteur, 25-28 Rue du Docteur Roux, 75015 Paris, France.; Backovic M; Institut Pasteur, Département de Virologie, Unité de Virologie Structurale, 75724 Paris Cedex 15, France.; UMR 3569 Virologie, CNRS-Institut Pasteur, 25-28 Rue du Docteur Roux, 75015 Paris, France.; Pérez-Vargas J; Institut Pasteur, Département de Virologie, Unité de Virologie Structurale, 75724 Paris Cedex 15, France.; UMR 3569 Virologie, CNRS-Institut Pasteur, 25-28 Rue du Docteur Roux, 75015 Paris, France.; de Boer SM; Virology Division, Department of Infectious Diseases and Immunology, Faculty of Veterinary Medicine, Utrecht University, Utrecht, Netherlands.; Tortorici MA; Institut Pasteur, Département de Virologie, Unité de Virologie Structurale, 75724 Paris Cedex 15, France.; UMR 3569 Virologie, CNRS-Institut Pasteur, 25-28 Rue du Docteur Roux, 75015 Paris, France.; Pehau-Arnaudet G; UMR 3528, CNRS, Institut Pasteur, 25-28 rue du Docteur Roux, 75015 Paris, France.; Lepault J; Institut de Biologie Intégrative de la Cellule, CNRS (UMR 9198), Gif-sur-Yvette, France.; England P; UMR 3528, CNRS, Institut Pasteur, 25-28 rue du Docteur Roux, 75015 Paris, France.; Proteopole, Plateforme de Biophysique des Macromolécules et de leurs Interactions (PFBMI), Institut Pasteur, 25-28 rue du Dr Roux, F-75724 Paris Cedex 15, France.; Rottier PJ; Virology Division, Department of Infectious Diseases and Immunology, Faculty of Veterinary Medicine, Utrecht University, Utrecht, Netherlands.; Bosch BJ; Virology Division, Department of Infectious Diseases and Immunology, Faculty of Veterinary Medicine, Utrecht University, Utrecht, Netherlands.; Hub JS; Institute for Microbiology and Genetics, University of Goettingen, Justus-von-Liebig weg 11, 37077 Göttingen, Germany. pablo.guardado-calvo@pasteur.fr jhub@gwdg.de felix.rey@pasteur.fr.; Rey FA; Institut Pasteur, Département de Virologie, Unité de Virologie Structurale, 75724 Paris Cedex 15, France. pablo.guardado-calvo@pasteur.fr jhub@gwdg.de felix.rey@pasteur.fr.; UMR 3569 Virologie, CNRS-Institut Pasteur, 25-28 Rue du Docteur Roux, 75015 Paris, France.

Publisher: American Association for the Advancement of Science Country of Publication: United States NLM ID: 0404511 Publication Model: Print Cited Medium: Internet ISSN: 1095-9203 (Electronic) Linking ISSN: 00368075 NLM ISO Abbreviation: Science Subsets: MEDLINE

Park Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.; Franz CK; Regenerative Neurorehabilitation Laboratory, Shirley Ryan AbilityLab, Chicago, IL 60611, USA.; Department of Physical Medicine and Rehabilitation, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA.; The Ken&Ruth Davee Department of Neurology, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA.; Ryu H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea.; Luan H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.; Cotton KY; Regenerative Neurorehabilitation Laboratory, Shirley Ryan AbilityLab, Chicago, IL 60611, USA.; Kim JU; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea.; Chung TS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA.; Zhao S; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.; School of Aeronautic Science and Engineering, Beihang University, Beijing 100191, P. R. China.; Vazquez-Guardado A; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.; Yang DS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; Li K; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Engineering, University of Cambridge, Cambridge CB2 1PZ, UK.; Avila R; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.; Phillips JK; Department of Neurosurgery, NorthShore University HealthSystem, Evanston, IL 60201, USA.; Department of Biomedical Engineering, University of Wisconsin-Madison, Madison, WI 53715, USA.; Quezada MJ; Regenerative Neurorehabilitation Laboratory, Shirley Ryan AbilityLab, Chicago, IL 60611, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA.; Jang H; Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI 53706, USA.; Kwak SS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea.; Won SM; Department of Electrical and Computer Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea.; Kwon K; School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, Republic of Korea.; Jeong H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; Bandodkar AJ; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; Han M; Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China.; Zhao H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA 90089, USA.; Osher GR; Department of Neurosurgery, NorthShore University HealthSystem, Evanston, IL 60201, USA.; Wang H; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.; Lee K; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; Zhang Y; Applied Mechanics Laboratory, Department of Engineering Mechanics; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China.; Huang Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA. y-huang@northwestern.edu jdfinan@uic.edu jrogers@northwestern.edu.; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.; Finan JD; Department of Neurosurgery, NorthShore University HealthSystem, Evanston, IL 60201, USA. y-huang@northwestern.edu jdfinan@uic.edu jrogers@northwestern.edu.; Department of Mechanical and Industrial Engineering, University of Illinois at Chicago, Chicago, IL 60607, USA.; Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA. y-huang@northwestern.edu jdfinan@uic.edu jrogers@northwestern.edu.; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Chemistry, Northwestern University, Evanston, IL 60208, USA.; Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA.

Publisher: American Association for the Advancement of Science Country of Publication: United States NLM ID: 101653440 Publication Model: Electronic-Print Cited Medium: Internet ISSN: 2375-2548 (Electronic) Linking ISSN: 23752548 NLM ISO Abbreviation: Sci Adv Subsets: MEDLINE

Santos-Seoane, S.M. ; Cabo-Madagán, R.; Rodriguez-Guardado, A.

In Revista Clínica Española (English Edition) April 2019 219(3):161-161

Gonçalves SM; Serviço de Radioterapia. Instituto Português de Oncologia de Coimbra. Coimbra. Portugal.; Ferreira BC; Departamento de Física. Universidade de Aveiro. Aveiro. Portugal.; Guardado MJ; Serviço de Radioterapia. Instituto Português de Oncologia de Coimbra. Coimbra. Portugal.; Marques R; Serviço de Radioterapia. Instituto Português de Oncologia de Coimbra. Coimbra. Portugal.; Serra T; Serviço de Radioterapia. Instituto Português de Oncologia de Coimbra. Coimbra. Portugal.; Serra MJ; Serviço de Radioterapia. Instituto Português de Oncologia de Coimbra. Coimbra. Portugal.; Roda D; Serviço de Radioterapia. Instituto Português de Oncologia de Coimbra. Coimbra. Portugal.; Brandão J; Serviço de Radioterapia. Instituto Português de Oncologia de Coimbra. Coimbra. Portugal.; Melo G; Serviço de Radioterapia. Instituto Português de Oncologia de Coimbra. Coimbra. Portugal.; Lopes MC; Serviço de Física Médica. Instituto Português de Oncologia de Coimbra. Coimbra. Portugal.; Khouri L; Serviço de Radioterapia. Instituto Português de Oncologia de Coimbra. Coimbra. Portugal.

Publisher: Centro Editor Livreiro da Ordem dos Médicos Country of Publication: Portugal NLM ID: 7906803 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1646-0758 (Electronic) Linking ISSN: 0870399X NLM ISO Abbreviation: Acta Med Port Subsets: MEDLINE

Santos-Seoane SM; Servicio de Medicina Interna, Hospital de Cabueñes, Gijón, Asturias, España. Electronic address: smsspulp@yahoo.es.; Fonseca Aizpuru EM; Servicio de Medicina Interna, Hospital de Cabueñes, Gijón, Asturias, España.; Rodríguez-Guardado A; Servicio de Medicina Interna, Hospital de Cabueñes, Gijón, Asturias, España.

Publisher: Saned, S.A Country of Publication: Spain NLM ID: 9610769 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1578-8865 (Electronic) Linking ISSN: 11383593 NLM ISO Abbreviation: Semergen Subsets: MEDLINE

Santos-Seoane SM; Servicio de Medicina Interna, Hospital de Cabueñes, Gijón, Asturias, España. Electronic address: smsspulp@yahoo.es.; Cabo-Madagán R; Servicio de Medicina Interna, Hospital de Cabueñes, Gijón, Asturias, España.; Rodriguez-Guardado A; Servicio de Medicina Interna, Hospital de Cabueñes, Gijón, Asturias, España.

Publisher: Elsevier España Country of Publication: Spain NLM ID: 101632437 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 2254-8874 (Electronic) Linking ISSN: 22548874 NLM ISO Abbreviation: Rev Clin Esp (Barc) Subsets: PubMed not MEDLINE