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IEEE Transactions on Vehicular Technology IEEE Trans. Veh. Technol. Vehicular Technology, IEEE Transactions on. 72(8):11080-11085 Aug, 2023
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IEEE Transactions on Consumer Electronics IEEE Trans. Consumer Electron. Consumer Electronics, IEEE Transactions on. 69(3):400-407 Aug, 2023
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Abdulhamid, M.I.Aboona, B.E.Adam, J.Adamczyk, L.Adams, J.R.Aggarwal, I.Aggarwal, M.M.Ahammed, Z.Aschenauer, E.C.Aslam, S.Atchison, J.Bairathi, V.Ball Cap, J.G.Barish, K.Bellwied, R.Bhagat, P.Bhasin, A.Bhatta, S.Bhosale, S.R.Bielcik, J.Bielcikova, J.Brandenburg, J.D.Broodo, C.Cai, X.Z.Caines, H.Calderón de la Barca Sánchez, M.Cebra, D.Ceska, J.Chakaberia, I.Chaloupka, P.Chan, B.K.Chang, Z.Chatterjee, A.Chen, D.Chen, J.Chen, J.H.Chen, Z.Cheng, J.Cheng, Y.Choudhury, S.Christie, W.Chu, X.Crawford, H.J.Csanád, M.Dale-Gau, G.Das, A.Deppner, I.M.Dhamija, A.Dixit, P.Dong, X.Drachenberg, J.L.Duckworth, E.Dunlop, J.C.Engelage, J.Eppley, G.Esumi, S.Evdokimov, O.Eyser, O.Fatemi, R.Fazio, S.Feng, C.J.Feng, Y.Finch, E.Fisyak, Y.Flor, F.A.Fu, C.Gagliardi, C.A.Galatyuk, T.Gao, T.Geurts, F.Ghimire, N.Gibson, A.Gopal, K.Gou, X.Grosnick, D.Gupta, A.Guryn, W.Hamed, A.Han, Y.Harabasz, S.Harasty, M.D.Harris, J.W.Harrison-Smith, H.He, W.He, X.H.He, Y.Herrmann, N.Holub, L.Hu, C.Hu, Q.Hu, Y.Huang, H.Huang, H.Z.Huang, S.L.Huang, T.Huang, X.Huang, Y.Humanic, T.J.Isshiki, M.Jacobs, W.W.Jalotra, A.Jena, C.Jentsch, A.Ji, Y.Jia, J.Jin, C.Ju, X.Judd, E.G.Kabana, S.Kalinkin, D.Kang, K.Kapukchyan, D.Kauder, K.Keane, D.Khanal, A.Khyzhniak, Y.V.Kikoła, D.P.Kincses, D.Kisel, I.Kiselev, A.Knospe, A.G.Ko, H.S.Kosarzewski, L.K.Kumar, L.Labonte, M.C.Lacey, R.Landgraf, J.M.Lauret, J.Lebedev, A.Lee, J.H.Leung, Y.H.Lewis, N.Li, C.Li, D.Li, H-S.Li, H.Li, W.Li, X.Li, Y.Li, Z.Liang, X.Liang, Y.Licenik, R.Lin, T.Lin, Y.Lisa, M.A.Liu, C.Liu, G.Liu, H.Liu, L.Liu, T.Liu, X.Liu, Y.Liu, Z.Ljubicic, T.Lomicky, O.Longacre, R.S.Loyd, E.M.Lu, T.Luo, J.Luo, X.F.Ma, L.Ma, R.Ma, Y.G.Magdy, N.Mallick, D.Manikandhan, R.Margetis, S.Markert, C.Matis, H.S.McNamara, G.Mezhanska, O.Mi, K.Mioduszewski, S.Mohanty, B.Mondal, M.M.Mooney, I.Nagy, M.I.Nain, A.S.Nam, J.D.Nasim, M.Neff, D.Nelson, J.M.Nemes, D.B.Nie, M.Nigmatkulov, G.Niida, T.Nonaka, T.Odyniec, G.Ogawa, A.Oh, S.Okubo, K.Page, B.S.Pak, R.Pal, S.Pandav, A.Pani, T.Paul, A.Pawlik, B.Pawlowska, D.Perkins, C.Pluta, J.Pokhrel, B.R.Posik, M.Protzman, T.Prozorova, V.Pruthi, N.K.Przybycien, M.Putschke, J.Qin, Z.Qiu, H.Racz, C.Radhakrishnan, S.K.Rana, A.Ray, R.L.Reed, R.Ritter, H.G.Robertson, C.W.Robotkova, M.Rosales Aguilar, M.A.Roy, D.Roy Chowdhury, P.Ruan, L.Sahoo, A.K.Sahoo, N.R.Sako, H.Salur, S.Sato, S.Schaefer, B.C.Schmidke, W.B.Schmitz, N.Seck, F-J.Seger, J.Seto, R.Seyboth, P.Shah, N.Shanmuganathan, P.V.Shao, T.Sharma, M.Sharma, N.Sharma, R.Sharma, S.R.Sheikh, A.I.Shen, D.Shen, D.Y.Shen, K.Shi, S.S.Shi, Y.Shou, Q.Y.Si, F.Singh, J.Singha, S.Sinha, P.Skoby, M.J.Smirnov, N.Söhngen, Y.Song, Y.Srivastava, B.Stanislaus, T.D.S.Stefaniak, M.Stewart, D.J.Stringfellow, B.Su, Y.Suaide, A.A.P.Sumbera, M.Sun, C.Sun, X.Sun, Y.Surrow, B.Sweger, Z.W.Tamis, A.C.Tang, A.H.Tang, Z.Tarnowsky, T.Thomas, J.H.Timmins, A.R.Tlusty, D.Todoroki, T.Trentalange, S.Tribedy, P.Tripathy, S.K.Truhlar, T.Trzeciak, B.A.Tsai, O.D.Tsang, C.Y.Tu, Z.Tyler, J.Ullrich, T.Underwood, D.G.Upsal, I.Van Buren, G.Vanek, J.Vassiliev, I.Verkest, V.Videbæk, F.Voloshin, S.A.Wang, F.Wang, G.Wang, J.S.Wang, J.Wang, K.Wang, X.Wang, Y.Wang, Z.Webb, J.C.Weidenkaff, P.C.Westfall, G.D.Wielanek, D.Wieman, H.Wilks, G.Wissink, S.W.Witt, R.Wu, J.Wu, X.Xi, B.Xiao, Z.G.Xie, G.Xie, W.Xu, H.Xu, N.Xu, Q.H.Xu, Y.Xu, Z.Yan, G.Yan, Z.Yang, C.Yang, Q.Yang, S.Yang, Y.Ye, Z.Yi, L.Yip, K.Yu, Y.Zbroszczyk, H.Zha, W.Zhang, C.Zhang, D.Zhang, J.Zhang, S.Zhang, W.Zhang, X.Zhang, Y.Zhang, Z.J.Zhang, Z.Zhao, F.Zhao, J.Zhao, M.Zhou, J.Zhou, S.Zhou, Y.Zhu, X.Zurek, M.Zyzak, M.
In Physics Letters B May 2024 852
Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(7):1003-1012 Jul, 2023
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IEEE Computer Architecture Letters IEEE Comput. Arch. Lett. Computer Architecture Letters. 22(2):149-152 Dec, 2023
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IEEE Computer Architecture Letters IEEE Comput. Arch. Lett. Computer Architecture Letters. 22(2):157-160 Dec, 2023
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IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(6):878-887 Jun, 2023
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IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(6):3255-3262 Jun, 2023
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IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 70(6):6377-6385 Jun, 2023
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[AR] Kang, K.
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