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Academic Journal
IEEE Transactions on Reliability IEEE Trans. Rel. Reliability, IEEE Transactions on. 72(4):1355-1366 Dec, 2023
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Ayres, N. J.; Ban, G.; Bison, G.; Bodek, K.; Bondar, V.; Bouillaud, T.; Bowles, D.; Chanel, E.; Chen, W.; Chiu, P. -J.; Crawford, C. B.; Naviliat-Cuncic, O.; Doorenbos, C. B.; Emmenegger, S.; Fertl, M.; Fratangelo, A.; Griffith, W. C.; Grujic, Z. D.; Harris, P. G.; Kirch, K.; Kletzl, V.; Krempel, J.; Lauss, B.; Lefort, T.; Lejuez, A.; Li, R.; Mullan, P.; Pacura, S.; Pais, D.; Piegsa, F. M.; Rienäcker, I.; Ries, D.; Pignol, G.; Rebreyend, D.; Roccia, S.; Rozpedzik, D.; Saenz-Arevalo, W.; Schmidt-Wellenburg, P.; Schnabel, A.; Segarra, E. P.; Severijns, N.; Svirina, K.; Dinani, R. Tavakoli; Thorne, J.; Vankeirsbilck, J.; Voigt, J.; Yazdandoost, N.; Zejma, J.; Ziehl, N.; Zsigmond, G.
Academic Journal
IEEE Internet of Things Journal IEEE Internet Things J. Internet of Things Journal, IEEE. 10(2):1733-1745 Jan, 2023
Academic Journal
Ayres, N.J.; Bondar, V.; Chen, W.; Doorenbos, C.B.; Emmenegger, S.; Kirch, K.; Kletzl, V.; Krempel, J.; Mullan, P.; Pais, D.; Ziehl, N.; Ban, G.; Naviliat-Cuncic, O.; Lefort, T.; Lejuez, A.; Saenz-Arevalo, W.; Bison, G.; Lauss, B.; Rienäcker, I.; Ries, D.; Schmidt-Wellenburg, P.; Segarra, E.P.; Zsigmond, G.; Bodek, K.; Pacura, S.; Rozpedzik, D.; Zejma, J.; Bouillaud, T.; Pignol, G.; Rebreyend, D.; Roccia, S.; Svirina, K.; Bowles, D.; Crawford, C.B.; Chanel, E.; Fratangelo, A.; Piegsa, F.M.; Thorne, J.; Chiu, P.-J.; Fertl, M.; Griffith, W.C.; Harris, P.G.; Grujic, Z.D.; Li, R.; Severijns, N.; Tavakoli Dinani, R.; Vankeirsbilck, J.; Schnabel, A.; Voigt, J.; Yazdandoost, N.
In: European Physical Journal C . (European Physical Journal C, January 2024, 84(1))
Academic Journal
Dams, A.; Van der Speeten, K.; Vankeirsbilck, J.; Poelmans, S.; Kerschaever, I.; Borreman, P.; Berwouts, L.; De Mulder, W.; Colle, J.; Beunis, A.; Dhooghe, V.; Van De Winkel, N.; Allaeys, M.; Ruyssers, M.; Haesen, D.
In: Surgical Endoscopy . (Surgical Endoscopy, December 2023, 37(12):9105-9115)
Academic Journal
IEEE Letters on Electromagnetic Compatibility Practice and Applications IEEE Lett. on Electromagn. Compat. Pract. and Appl. Electromagnetic Compatibility Practice and Applications, IEEE Letters on. 3(1):34-37 Mar, 2021
Academic Journal
IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 62(5):1929-1938 Oct, 2020
Academic Journal
IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 62(4):1017-1027 Aug, 2020
Academic Journal
In: Electronics (Switzerland) . (Electronics (Switzerland), October 2022, 11(20))
Academic Journal
In: Electronics (Switzerland) . (Electronics (Switzerland), May-1 2022, 11(9))
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[AR] Vankeirsbilck, J.
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