학술논문
'학술논문'
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Academic Journal
Upchurch, S.; Wold, B.J.; Palumbo, E.; Righi, E.; Guigó, R.; Adams, J.; Bujold, D.; Bourque, G.; Nedzel, J.; Graham, K.; Kagda, M.S.; Assis, P.; Hitz, B.; Clark, L.; Diekhans, M.; Glazer, D.; Linnarsson, S.; Yates, A.; Brazma, J.A.A.; Burchard, D.B.J.; Capka, J.; Cherry, M.; Clarke, L.; Craft, B.; Dermitzakis, M.; Dursi, J.; Fitzsimons, M.S.; Flaming, Z.; Garrido, R.; Gil, A.; Godden, P.; Green, M.; Guttman, R.G.M.; Haas, B.; Haeussler, M.; Li, B.H.B.; Linnarsson, S.; Lipski, A.; Liu, D.; Longerich, S.; Lougheed, D.; Manning, J.; Marioni, J.; Meyer, C.; Montgomery, S.; Morrow, A.; Fuentes, A.M.-P.; Nguyen, J.N.D.; Osborn, K.; Ouellette, F.; Papatheodorou, E.P.I.; Pervouchine, D.; Ramani, A.; Rambla, J.; Sadjad, B.; Steinberg, D.; Talkar, J.; Tickle, T.; Tzeng, K.; Vaisipour, S.U.S.; Watford, S.; Zhang, B.W.Z.; Zhu, J.
In: Bioinformatics . (Bioinformatics, 1 April 2023, 39(4))
Conference
In: 2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022 , 2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022. (2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022, 2022, 2022-January:546-548)
Conference
Chang, P.; Li, Y.L.; Hsu, J.; Lee, F.; Qin, S.; Liang, K.; Tzeng, K.; Cheng, Y.H.; Chen, C.H.; Wei, H.
In: 2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022 , 2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022. (2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022, 2022, 2022-January:542-545)
Conference
Qin, S.; Chang, P.; Lee, F.; Su, T.; Chen, D.; Li, Y.; Hsu, J.; Liang, K.; Tsai, B.; Tzeng, K.; Guo, A.; Yuan, W.; Cao, M.; Chang, A.; Fan, D.
In: Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT , Proceedings - 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2022, 2022-October)
Academic Journal
Ang, S.O.; Maiti, S.N.; Moriarity, B.; Andrews, K.; Ossowski, M.; Tzeng, K.; Talbot, R.; Kellar, D.; Huls, H.; Kebriaei, P.; Kelly, S.; Shpall, E.; Largaespada, D.A.; Champlin, R.; Hackett, P.B.; Cooper, L.J.N.
In Biology of Blood and Marrow Transplantation 2012 18(2) Supplement:S219-S219
Academic Journal
IEEE Transactions on Information Theory IEEE Trans. Inform. Theory Information Theory, IEEE Transactions on. 21(6):712-716 Nov, 1975
Academic Journal
IEEE Transactions on Information Theory IEEE Trans. Inform. Theory Information Theory, IEEE Transactions on. 20(2):292-295 Mar, 1974
Academic Journal
IEEE Transactions on Information Theory IEEE Trans. Inform. Theory Information Theory, IEEE Transactions on. 19(6):820-823 Nov, 1973
Academic Journal
IEEE Transactions on Information Theory IEEE Trans. Inform. Theory Information Theory, IEEE Transactions on. 18(3):402-409 May, 1972
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[AR] Tzeng, K.
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