학술논문
'학술논문'
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Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction
Academic Journal
IEEE Access Access, IEEE. 9:22859-22867 2021
Academic Journal
IEEE Access Access, IEEE. 9:76307-76314 2021
Academic Journal
In Journal of Archaeological Science 2011 38(12):3533-3540
Academic Journal
In: International Journal on Interactive Design and Manufacturing . (International Journal on Interactive Design and Manufacturing, 2023)
Academic Journal
In: Engineering Fracture Mechanics . (Engineering Fracture Mechanics, 1 May 2022, 266)
Academic Journal
In: Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science . (Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, December 2021, 235(24):7734-7742)
Academic Journal
In: Applied Sciences (Switzerland) . (Applied Sciences (Switzerland), September 2021, 11(18))
Academic Journal
In: Applied Sciences (Switzerland) . (Applied Sciences (Switzerland), 1 August 2021, 11(15))
Academic Journal
In: Applied Sciences (Switzerland) . (Applied Sciences (Switzerland), 1 June 2021, 11(11))
Academic Journal
Petrecca, M.; Oliveri, S.M.; Albino, M.; Innocenti, C.; Sangregorio, C.; Muzzi, B.; Yaacoub, N.; Peddis, D.; De Julián Fernández, C.
In: Journal of Physics D: Applied Physics . (Journal of Physics D: Applied Physics, 1 April 2021, 54(13))
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[AR] Oliveri, S.M.
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