학술논문
'학술논문'
에서 검색결과 66건 | 목록
1~10
Academic Journal
Vaidya, V.G.; Naik, N.N.; Ganu, G.; Parmar, V.; Jagtap, S.; Saste, G.; Bhatt, A.; Mulay, V.; Girme, A.; Modi, S.J.; Hingorani, L.
In: Journal of Ethnopharmacology . (Journal of Ethnopharmacology, 25 March 2024, 322)
Academic Journal
In: Journal of AOAC International . (Journal of AOAC International, 1 January 2024, 107(1):129-139)
Academic Journal
In: ACS Omega . (ACS Omega, 7 November 2023, 8(44):40982-41003)
Conference
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st. :203-207 Mar, 2015
Conference
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st. :319-323 Mar, 2015
Conference
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on. :403-407 2002
Academic Journal
In: Journal of Electronic Packaging, Transactions of the ASME . (Journal of Electronic Packaging, Transactions of the ASME, 1 June 2019, 141(2))
Conference
Simon, V.S.; Pundla, S.A.; Sivaraju, K.B.; Gupta, G.; Bansode, P.; Agonafer, D.; Karajgikar, S.; Mulay, V.
In: Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023 , Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023. (Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023, 2023)
Academic Journal
In: Journal of Electronic Packaging, Transactions of the ASME . (Journal of Electronic Packaging, Transactions of the ASME, 1 December 2017, 139(4))
Academic Journal
In: Journal of Electronic Packaging, Transactions of the ASME . (Journal of Electronic Packaging, Transactions of the ASME, 1 December 2017, 139(4))
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[AR] Mulay, V.
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