학술논문
'학술논문'
에서 검색결과 164건 | 목록
1~20
Academic Journal
In Applied Surface Science 15 February 2025 682
Academic Journal
Tian, Ye; Gao, Runhua; Wang, Xinhua; Mu, Fengwen; Xu, Peng; Ma, Guoliang; Yuan, Chao; Huang, Sen; Sun, Bing; Wei, Ke; Liu, Xinyu
In Journal of Alloys and Compounds 25 November 2024 1006
Academic Journal
Gao, Runhua; Wang, Xinhua; Mu, Fengwen; Li, Xiaojing; Wei, Chong; Zhou, Wu; Shi, Jin’an; Tian, Ye; Xing, Xiangjie; Li, Hongyue; Huang, Sen; Jiang, Qimeng; Wei, Ke; Liu, Xinyu
In Journal of Alloys and Compounds 25 May 2024 985
Conference
2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :01-05 Aug, 2024
Academic Journal
Mu, Fengwen; Xu, Bin; Wang, Xinhua; Gao, Runhua; Huang, Sen; Wei, Ke; Takeuchi, Kai; Chen, Xiaojuan; Yin, Haibo; Wang, Dahai; Yu, Jiahan; Suga, Tadatomo; Shiomi, Junichiro; Liu, Xinyu
In Journal of Alloys and Compounds 5 June 2022 905
Academic Journal
Xu, Wenhui; You, Tiangui; Wang, Yibo; Shen, Zhenghao; Liu, Kang; Zhang, Lianghui; Sun, Huarui; Qian, Ruijie; An, Zhenghua; Mu, Fengwen; Suga, Tadatomo; Han, Genquan; Ou, Xin; Hao, Yue; Wang, Xi
In Fundamental Research November 2021 1(6):691-696
Academic Journal
In Journal of Materials Science & Technology 15 October 2020 55:16-34
Conference
Li, Hongyue; Wang, Xinhua; Mu, Fengwen; Tian, Ye; Xing, Xiangjie; Jiang, Qimeng; Huang, Sen; Liu, Xinyu
2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2024 8th International Workshop on. :1-1 Oct, 2024
Academic Journal
Mu, Fengwen; Uomoto, Miyuki; Shimatsu, Takehito; Wang, Yinghui; Iguchi, Kenichi; Nakazawa, Haruo; Takahashi, Yoshikazu; Higurashi, Eiji; Suga, Tadatomo
In Applied Surface Science 28 January 2019 465:591-595
Academic Journal
In Materialia November 2018 3:12-14
Academic Journal
In Applied Surface Science 15 September 2017 416:1007-1012
Academic Journal
Jing, Guanjun; Xing, Xiangjie; Zhang, Dongguo; Mu, Fengwen; Huang, Sen; Wei, Ke; Jiang, Qimeng; Wang, Xinhua; Liu, Xinyu
Journal of Vacuum Science & Technology: Part B-Nanotechnology & Microelectronics; Jan2025, Vol. 43 Issue 1, p1-8, 8p
Conference
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2024-2029 Jun, 2021
Conference
Meng, Ying; Gao, Runhua; Wang, Xinhua; Chen, Xiaojuan; Huang, Sen; Wei, Ke; Wang, Dahai; Mu, Fengwen; Liu, Xinyu
2021 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA) Integrated Circuits, Technologies and Applications (ICTA), 2021 IEEE International Conference on. :201-203 Nov, 2021
Conference
2021 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2021 IEEE. :135-137 Nov, 2021
Conference
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1328-1331 Jun, 2020
Academic Journal
Li, Haonan; Wu, Hongjun; Chen, Xiuhua; Ma, Wenhui; Lv, Guoqiang; Mu, Fengwen; Sun, Zhaorui; Li, Shaoyuan; Sun, Huizhen; Fu, Kaixin
Journal of Physics: Conference Series; 2024, Vol. 2840 Issue 1, p1-9, 9p
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[AR] Mu, Fengwen
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